Optical waveguide overlapped unit

Abstract

The invention discloses an optical waveguide overlapped unit. The optical waveguide overlapped unit is obtained by laminating an upper metal layer, a prepreg, an upper package layer, an optical waveguide layer, a lower package layer, and a lower metal layer from top to bottom, wherein the upper metal layer is composed of a plurality of metal sheets or metal wires which are arranged at designated intervals, the lower metal layer is composed of a plurality of metal sheets or metal wires which are arranged at designated intervals, and the optical waveguide layer includes a plurality of optical waveguide layers which are overlapped in the same plane. According to the invention, the optical waveguide overlapped unit can significantly increase the intensity of optical interconnection, increasesoptical transmission channels, and also makes devices and equipments smaller in size.

Description

technical field [0001] The invention relates to the technical field of optical waveguide interconnection design, in particular to an optical waveguide cross unit. Background technique [0002] With the continuous improvement of the data transmission rate and frequency of computer systems and communication systems, traditional electrical interconnection is facing its development bottleneck. The main problems are: (1) Scattering, reflection, attenuation, and signal strength fluctuations with frequency can all distort high-speed signals , resulting in limited bandwidth; (2) With the increase of wiring density, line signals are susceptible to electromagnetic interference (Electromagnetic Interference, EMI) from single boards and chassis. [0003] Optical waveguide interconnection is the optimal solution to realize Tbit / s high-speed interconnection, and its technical realization is usually to integrate optical waveguide into PCB (Printed Circuit Board, printed circuit board) to m...

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Problems solved by technology

[0002] With the continuous improvement of the data transmission rate and frequency of computer systems and communication systems, traditional electrical interconnection is facing its development bottleneck. The main problems are: (1) Scattering, reflection, attenuation, and signal strength fluctuations with frequency can all distort high-speed signals , resulting in limited bandwidth; (2) As the wiring density increases, the line signal is susceptible to electromagnetic interference (Electromagnetic Interference, EMI) from the single board and the chassis

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