Leadless electroplated circuit board and manufacturing method thereof

Abstract

The electroplated circuit board without a conductor comprises a first conductive line layer, a first substrate layer, a second conductive line layer, a third conductive line layer, a plurality of first conductive holes, a plurality of third conductive holes, first filling holes, a second filling hole and a welding pad, wherein the first conductive line layer, the first substrate layer, the secondconductive line layer and the third conductive line layer are successively stacked; each first conductive hole passes through the first conductive line layer and the second conductive line layer; thethird conductive holes pass through the third conductive line layer and are electrically connected to the second conductive line layer; the number of the first filling holes is consistent with the number of the first conductive holes, and the second filling hole is connected to the first filling holes and is not conducted with the first filling holes; the first filling holes at least pass throughthe first conductive line layer, the first substrate layer and the second conductive line layer; the second filling hole at least passes through the third conductive line layer; the welding pad is formed on a surface of the first conductive line layer; and the welding pad is formed through electroplating a surface of the first conductive line layer without the conductor.

Description

Technical field [0001] The invention relates to a method for manufacturing a non-wire electroplated circuit board and a non-wire electroplated circuit board. Background technique [0002] Consumer electronics products are becoming lighter, thinner, shorter and more intelligent. As an important component, flexible circuit boards (FPC) are widely used. The production requirements for FPC are getting higher and higher. The surface treatment (gold plating) of circuit boards is usually made. Method Pull the lead at the gold-plated pad (PAD) or gold finger to connect to the ground to form a circuit to form the PAD, then use laser or secondary etching to remove the plated lead; but use this method to remove the lead At this time, it is prone to incomplete lead etching, or over-etching can easily cause pad defects. Summary of the invention [0003] In view of this, it is necessary to provide a method for manufacturing a non-lead electroplated circuit board and a circuit board manufacture...

AI Technical Summary

Problems solved by technology

[0002] Consumer electronics products are becoming increasingly light, thin, and intelligent. As an important component, flexible circuit boards (FPC) are widely used in them, and the requirements for FPC production are getting higher and higher. For circuit board surface treatment (gold plating) usually The method is to pull the lead at the pad (PAD) or gold finger to be plated and connect it to the ground to form a circuit for electroplating to form the PAD, and then use the punching (laser) or secondary etching to remove the plating lead; however, this method is used to remove the lead When the lead wire is not etched completely, or the over-etching is easy to cause the pad defect

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