High-temperature-resistance transfer device

Abstract

A high-temperature-resistant transfer device, including a partition, a clamping mechanism, and a power component that drives the clamping mechanism through a rope control component. The power component is installed on a power plate seat on one side of the partition. The clamping mechanism includes: horizontally installed on The clamping board seat on the other side of the partition, the skateboard frame slidably connected under the clamping board seat, and the pulley assembly and jaw assembly located on the skateboard frame; the rope control assembly includes: guide wheels and transfer wire ropes, of which four The two guide wheels are symmetrically installed on both sides of the upper end of the power plate seat and the two sides of the bottom end of the clamping plate seat, so that the installation positions of the four guide wheels form four corners of a rectangle, and the transfer steel wire rope passes through the partition and winds around these four corners. on a guide wheel, and the transfer wire rope passes through the power assembly and is fixedly connected with the power assembly, passes through the lower end of the skateboard frame and is fixedly connected with the skateboard frame. The invention realizes the transfer action of the product or the carrier under the high temperature environment, has excellent high temperature resistance performance, and is suitable for various working environments.

Description

technical field [0001] The invention relates to a transfer device in the field of mechanical automation, which is mainly used for clamping and transferring actions of carriers in high-temperature environments such as the drying process and hot bending process of various electronic products, glass products and metal parts. Background technique [0002] At present, a large number of high-temperature transfer devices used in the market can only transfer products or carriers from room temperature to high-temperature environments, transfer from high-temperature environments to room temperature environments, or only transfer products in high-temperature environments. Or the carrier performs a simple propulsion action, but it has never been able to perform complex actions such as clamping and moving in a high-temperature environment, which limits automated processing in a high-temperature environment. [0003] Therefore, in view of the prior art, how to design and develop a transfe...

AI Technical Summary

Problems solved by technology

[0002] At present, a large number of high-temperature transfer devices used in the market can only transfer products or carriers from room temperature to high-temperature environments, transfer from high-temperature environments to room temperature environments, or only transfer products in high-temperature environments. Or the carrier performs a simple propulsion action, but it has never been able to perform complex actions such as clamping and moving in a high-temperature environment, which limits automated processing in a high-temperature environment

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