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A device and method for self-assembly of micro-devices based on micro-vibration excitation

A self-assembly, micro-device technology, applied in microstructure devices, manufacturing microstructure devices, measurement devices, etc., can solve the problems of weakening the positioning accuracy of micro-components and substrates, low assembly efficiency, etc., to solve the problem of low assembly efficiency and improve assembly. success rate effect

Active Publication Date: 2019-11-22
美泰(常州)控制系统有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Drivers and display units in flat panel display (FPD) devices, high-density alignment assembly of LED chips, micro-control systems, optoelectronic smart array sensors, and electronic labels all require repeated precision assembly of large quantities of micro-components, fluid self-assembly technology The shape-matching alignment in the system has the ability to assemble a large number of micro-components in parallel and accurately in three-dimensional space. When under the action, it will randomly fall into the matching pits on the substrate. The traditional hydraulic pump valve drives the uniform flow of the solution. When the micro-component is close to the assembly point of the substrate, the inertia of its motion will weaken the positioning accuracy of the micro-component and the substrate. There will be some micro-component positioning that is not completely embedded with the substrate, resulting in low assembly efficiency

Method used

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  • A device and method for self-assembly of micro-devices based on micro-vibration excitation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] This embodiment provides a self-assembly device based on micro-vibration excitation micro-device, the structure is as follows figure 1 Shown:

[0015] On the substrate 1 such as silicon or glass, there is an array of pits of corresponding shapes etched out, each pit is matched with a micro-element 2 of a specific shape manufactured from a silicon wafer, and the micro-element 2 is carried by a carrier solution 3, The partition plate 4 and the substrate 1 form an assembly cavity, and the substrate 1 such as silicon or glass is rigidly connected to one end of the piezoelectric stack driver 6 through a rigid connecting plate 5, and the other end of the piezoelectric stack driver 6 is fixed on the fixed support 7 , the piezoelectric stack driver is controlled by a computer 9 and a driving power supply 8 .

Embodiment 2

[0017] This embodiment provides a self-assembly method based on the self-assembly device described in Embodiment 1.

[0018] The excess microelements 2 are dispersed and suspended in the selected carrier solution 3, and can flow through the substrate 1 and the separator 4 under pressure, and the computer 9 is programmed to control the piezoelectric stack driver 6 through the driving power supply 8 to fix the The support 7 supports lateral vibration, and the computer 9 is programmed to control the amplitude, frequency and acceleration of the piezoelectric stack driver 6 through the drive power supply 8 .

[0019] When the carrier solution 3 suspends an excessive amount of micro-elements 2 and flows through the array of pits on the substrate 1, the micro-elements, the capillary force and surface tension of the liquid bonding material will randomly fall into the matching pits on the substrate , some of the micro components 2 are completely fitted into the pits of the substrate, a...

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Abstract

The invention discloses a micro device self assembly device and method based on micro vibration excitation. The device comprises a substrate and a clapboard, a pit array is etched on the substrate, each pit in the pit array is matched with the appearance of a micro device, the micro device is loaded by a carrier solution, the clapboard and the substrate form an assembly cavity, the substrate is inrigid connection with one end of a piezoelectric stacking driver, the other end of the piezoelectric stacking driver is fixedly installed on a fixing support, and the piezoelectric stacking driver iscontrolled by a computer and a driving power supply. The micro device self assembly device excites the substrate via piezoelectric vibration, so that the micro device that is not completely embeddedwith the substrate on the substrate skips from a metastable state to expected energy of the assembly structure so as to completely embedded with the substrate, and when the carrier solution is removed, the lower surface of the micro device is connected with the bottom surfaces of the pits under the action of Van der Waals' force. The excitation can be adjusted on frequency, amplitude and waveformso as to adapt to the micro assembly requirements of different scales and appearances, and improve the assembly success rate.

Description

technical field [0001] The invention relates to an assembly device and method for micro components, in particular to an automatic assembly device and method for micro components. Background technique [0002] Drivers and display units in flat panel display (FPD) devices, high-density alignment assembly of LED chips, micro-control systems, optoelectronic smart array sensors, and electronic labels all require repeated precision assembly of large quantities of micro-components, fluid self-assembly technology The shape-matching alignment in the system has the ability to assemble a large number of micro-components in parallel and accurately in three-dimensional space. When under the action, it will randomly fall into the matching pits on the substrate. The traditional hydraulic pump valve drives the uniform flow of the solution. When the micro-component is close to the assembly point of the substrate, the inertia of its motion will weaken the positioning accuracy of the micro-com...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00B81C1/00
CPCB81B7/0003B81C1/00007
Inventor 刘天军刘青苑张杨
Owner 美泰(常州)控制系统有限公司
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