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Broadband C-band solid-state power amplifier module

A power amplifier module, solid-state power amplifier technology, applied in the direction of power amplifier, amplifier protection circuit layout, improving amplifier to improve efficiency, etc., can solve the problems of no modular design, disadvantageous work efficiency and reliability, disadvantageous mass production, etc. Assembly efficiency and success rate, good linearity and work efficiency, the effect of avoiding damage

Pending Publication Date: 2021-02-05
NANJING CHANGFENG AEROSPACE ELECTRONICS SCI & TECH
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AI Technical Summary

Problems solved by technology

[0003] The currently designed solid-state power amplifiers have relatively narrow bandwidth and no modular design, which makes debugging inconvenient and not conducive to mass production; the matching effect between amplifier stages is not ideal, which is not conducive to improving work efficiency and reliability

Method used

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  • Broadband C-band solid-state power amplifier module
  • Broadband C-band solid-state power amplifier module
  • Broadband C-band solid-state power amplifier module

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Embodiment Construction

[0034] Structurally, the C-band solid-state power amplifier adopts a modular design, and each module can be installed and disassembled independently. It has the advantages of small size, portability, light weight and high integration, and has the advantages of convenient disassembly and maintenance and high reliability. The overall structure of the solid-state power amplifier module is shown as figure 1 shown.

[0035] figure 1 In the logo:

[0036] 1. The C-band solid-state power amplifier component is the core part of this application, which undertakes the amplification function of the power amplifier module, and can amplify the weak small radio frequency signal to a certain power radio frequency signal for output;

[0037] 2. The heat dissipation system is composed of a fan and a radiator. The heat dissipation system is used to timely export heat from the power amplifier and ensure good ventilation.

[0038] Ensure that the equipment continues to work stably under the co...

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PUM

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Abstract

The invention discloses a broadband C-band solid-state power amplifier module which comprises a C-band solid-state power amplifier assembly, a heat dissipation system and a power amplifier fixing device; the C-band solid-state power amplifier assembly is connected with the heat dissipation system, and the C-band solid-state power amplifier assembly is used for amplifying the power of a radio frequency signal, the heat dissipation system is used for guiding out heat emitted by a C-band solid-state power amplifier assembly power amplifier, and the power amplifier fixing device is connected withthe heat dissipation system. In the aspect of structural layout, modular design is adopted, all the modules can be independently installed and detached, and the advantages of being small in size, convenient to carry, light in weight, high in integration degree, convenient to detach and maintain, high in reliability and the like are achieved.

Description

technical field [0001] The invention relates to a solid-state power amplifier module, in particular to a broadband C-band solid-state power amplifier module. Background technique [0002] As an important part of the transmission system, solid-state power amplifiers are widely used in electromagnetic compatibility EMC, wireless communication, satellite communication, radar, radio, television, high-energy physics research, advanced medical equipment, electronic countermeasures and other fields. With the advancement of semiconductor technology and related process technology, solid-state power amplifiers are also developing towards high power, high efficiency, broadband, and miniaturization, and have good application prospects. [0003] The currently designed solid-state power amplifiers have relatively narrow bandwidth and no modular design, which is inconvenient for debugging and is not conducive to mass production; the matching effect between amplifier stages is not ideal, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F1/02H03F1/52H03F3/20
CPCH03F1/02H03F1/52H03F3/20
Inventor 杨现志吴皓黄光泉
Owner NANJING CHANGFENG AEROSPACE ELECTRONICS SCI & TECH
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