High-temperature-resistant printing ink and preparation method thereof
A technology of high temperature resistant ink and organic amine, applied in ink, household appliances, applications, etc., can solve the problems of reduced performance, yellowing and fading, etc.
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[0015] The present invention provides a kind of preparation method of high temperature resistant ink, wherein, described preparation method comprises:
[0016] 1) mixing ethyl silicate, azodicarbonamide and nano-titanium dioxide to prepare a mixture M1;
[0017] 2) Dropping an organic amine into the mixture M1 for reaction to prepare a mixture M2;
[0018] 3) mixing the mixture M2, diaminodiphenylsulfone, 2-methylimidazole and dibutyltin phthalate to prepare a curing agent;
[0019] 4) Mixing the silicone resin, the curing agent prepared in step 3), kaolin, barium sulfate and silane coupling agent to prepare a high temperature resistant ink.
[0020] In the present invention, after mixing ethyl silicate, azodicarbonamide and nano-titanium dioxide, organic amine is added dropwise therein, and further, the above-mentioned mixture is mixed with diaminodiphenylsulfone, 2-methylimidazole and phthalic disulfone Dibutyltin formate is mixed to prepare a curing agent, and then the ab...
Embodiment 1
[0038] 1) Stirring and mixing 100 parts by weight of ethyl silicate, 5 parts by weight of azodicarbonamide and 1 part by weight of nano-titanium dioxide at a temperature of 80° C. for 0.5 h to prepare a mixture M1;
[0039] 2) Add 5 parts by weight of diethylenetriamine dropwise to 100 parts by weight of the mixture M1 (this diethylenetriamine is provided by a xylene solution of diethylenetriamine with a diethylenetriamine content of 30% by weight) and place React at a temperature of 80°C for 2 hours, then raise the temperature to 130°C at a heating rate of 40°C to prepare a mixture M2;
[0040] 3) 100 parts by weight of the mixture M2, 10 parts by weight of diaminodiphenylsulfone, 5 parts by weight of 2-methylimidazole and 5 parts by weight of dibutyltin phthalate are mixed at a stirring rate of 100r / min, Prepare curing agent;
[0041] 4) 100 parts by weight of silicone resin, 5 parts by weight of the curing agent prepared in step 3), 10 parts by weight of kaolin, 3 parts by...
Embodiment 2
[0043] 1) Stir and mix 100 parts by weight of ethyl silicate, 15 parts by weight of azodicarbonamide and 5 parts by weight of nano-titanium dioxide at a temperature of 100° C. for 1 hour to prepare a mixture M1;
[0044] 2) Add 10 parts by weight of xylylenediamine dropwise to 100 parts by weight of the mixture M1 (this xylylenediamine is provided by a xylene solution of xylylenediamine with a xylylenediamine content of 50% by weight) before placing React at a temperature of 100°C for 4 hours, then raise the temperature to 150°C at a heating rate of 60°C to prepare a mixture M2;
[0045] 3) 100 parts by weight of the mixture M2, 20 parts by weight of diaminodiphenyl sulfone, 15 parts by weight of 2-methylimidazole and 15 parts by weight of dibutyltin phthalate are mixed at a stirring rate of 200r / min, Prepare curing agent;
[0046] 4) 100 parts by weight of silicone resin, 15 parts by weight of the curing agent prepared in step 3), 20 parts by weight of kaolin, 5 parts by wei...
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