Six-layer integrated circuit board and preparation method therefor
An integrated circuit board and circuit technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problems of decreased flexural performance and bending performance, unsmooth production of batch boards, and low yield of finished products, etc. Improve the bending performance and bending performance, improve the production efficiency and the qualified rate of finished products, and improve the effect of heat dissipation
Inactive Publication Date: 2018-02-09
万奔电子科技股份有限公司
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Problems solved by technology
For the six-layer integrated copper substrate in the prior art, due to the complex structure of the pressing board, the production of each subsequent batch of boards is not smooth, the process is complicated, and the qualified rate of the finished product is low; in addition, due to the number of layers of the circuit board, Glue is needed between the flexible soft board and the flexible soft board to combine the soft board, resulting in a thicker soft board, resulting in a decrease in flexural and bending properties
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] see figure 1 , the present invention provides a technical solution: a six-layer integrated circuit board, including a first-layer copper circuit L1, a second-layer copper circuit L2, a third-layer copper circuit L3, a fourth-layer copper circuit L4, a fifth-layer copper circuit The circuit L5 and the sixth layer copper circuit L6, the first layer copper circuit L1 and the second layer copper circuit L2 are respectively arranged on the upper end face and...
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The invention discloses a six-layer integrated circuit board and a preparation method therefor. The six-layer integrated circuit board comprises a first layer of copper circuit, a second layer of copper circuit, a third layer of copper circuit, a fourth layer of copper circuit, a fifth layer of copper circuit and a sixth layer of copper circuit; the six-layer integrated circuit board is characterized in that the first layer of copper circuit and the second layer of copper circuit are arranged on the upper end plane and the lower end plane of a first copper-clad plate respectively; the third layer of copper circuit and the fourth layer of copper circuit are arranged on the upper end plane and the lower end plane of a second copper-clad plate respectively; the fifth layer of copper circuit and the sixth layer of copper circuit are arranged on the upper end plane and the lower end plane of a third copper-clad plate respectively; the third layer of copper circuit is a power supply layer; the fourth layer of copper circuit is a grounding layer; and the first layer of copper circuit, the second layer of copper circuit, the fifth layer of copper circuit and the sixth layer of copper circuit are all signal layers. The flexibility and bending performance of the circuit board are improved, the heat dissipation effect is also improved, the process complexity is lowered, and the productionefficiency and the finished product percent of pass are improved.
Description
technical field [0001] The invention relates to the technical field of integrated circuit production, in particular to a six-layer integrated circuit board and a preparation method thereof. Background technique [0002] PCB is the abbreviation of Printed Circuit Board (Printed Circuit Board), which appears in almost every electronic device. As electronic devices become more and more complex, the circuits and parts on the PCB board are becoming more and more dense. PCB boards develop through single-sided, double-sided, and multi-layer, and the proportion of multi-layer boards is increasing year by year. For the six-layer integrated copper substrate in the prior art, due to the complex structure of the pressing board, the production of each subsequent batch of boards is not smooth, the process is complicated, and the qualified rate of the finished product is low; in addition, due to the number of layers of the circuit board, Glue is needed between the flexible soft board and...
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IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0298H05K3/4644
Inventor 金赛勇
Owner 万奔电子科技股份有限公司