Micro loop heat pipe and method

Abstract

The invention discloses a micro loop heat pipe and a method. The micro loop heat pipe comprises an evaporation chamber. One end of the evaporation chamber is connected with an inlet of a condensing chamber through a steam pipe. The other end of the evaporation chamber is connected with an outlet of the condensing chamber through a liquid backflow pipe. The interior of the evaporation chamber is partitioned into an evaporation space and a backflow liquid storage space communicating with the evaporation space through a thermal insulating partition plate made of a thermal insulating material. A plurality of layers of capillary cores with different hole diameters are arranged in each of the evaporation space and the backflow liquid storage space. When external heat is input through the wall surface of the evaporation space, a nano fluid working medium in the evaporation space is heated and evaporated to generate steam; and the steam enters the condensing chamber through the steam pipe andis condensed, then flows back to the backflow liquid storage space along the liquid backflow pipe, and then returns to the evaporation space through the bottom of the evaporation chamber, namely a bottom channel of the thermal insulating partition plate; and circulation is achieved in this way.

Description

technical field [0001] The invention relates to heat pipes, in particular to a micro-loop heat pipe and method. Background technique [0002] The reliability of electronic equipment is extremely sensitive to temperature, and the reliability will drop by 5% for every 1°C increase in device temperature at the level of 70-80°C. Therefore, the internal heat dissipation problem of electronic components is particularly prominent. The failure caused by high temperature accounts for 50% of all electronic product failures, and heat dissipation has become a bottleneck in the development of miniaturization of electronic products. [0003] Miniature Loop Heat Pipe (mLHP) consists of five parts: evaporation chamber, condensation chamber, liquid storage chamber, steam pipe and liquid pipe, and mainly relies on capillary structure to provide circulating power for fluid working medium. This type of heat pipe has the advantages of large heat transfer power, good isothermal performance, high...

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Problems solved by technology

[0008] The purpose of the present invention is to overcome the shortcomings and deficiencies of the above-mentioned prior art, provide a simple structure, high heat transfer efficiency micro loop heat pipe and method, solve the problem of affecting the heat transfer performance of the micro loop heat pipe due to the agglomeration of nano fluids

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