Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ring-wave repeated drawing high deformation mold for plate and machining method

A mold and plate technology, which is applied in the field of plate ring-wave repeated drawing and strong deformation mold and processing, can solve the problems of uneven plate deformation, uneven strain, and the inability to accumulate strain at the ring-wave connection, so as to achieve a controllable deformation process, The effect of uniform strain distribution and improvement of anisotropy

Inactive Publication Date: 2018-02-23
YANSHAN UNIV
View PDF6 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this process has disadvantages: only a single set of dies is used to repeatedly draw the sheet, and there is always a micro-deformed area in the deformation process of the sheet, especially when the number of repeated drawing is too many, the strain is at the corresponding deformation of the peaks and troughs of each ring die. A large amount of accumulation, the joint of the ring wave can not accumulate enough strain, so that the deformation of the plate is uneven, and the more times of repeated drawing, the more obvious the uneven strain

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ring-wave repeated drawing high deformation mold for plate and machining method
  • Ring-wave repeated drawing high deformation mold for plate and machining method
  • Ring-wave repeated drawing high deformation mold for plate and machining method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0049] For a 5083Al alloy circular sheet with a diameter of 88mm and a thickness of 0.63mm (the original sheet, hereinafter referred to as the sheet), the ring-wave repeated drawing and strong deformation is carried out, including the following passes:

[0050] Pass 1: Place the plate in the center of ring wave lower die A7 as Figure 14 As shown in (a), adjust the positioning screw A3, and the calibration plate is accurately aligned with the center of the ring wave lower mold A7.

[0051] Pass 2: Start the hydraulic press, first make the upper die A9 of the ring wave start to move down quickly to a distance of about 0.5mm from the plate, then reduce the speed of the upper die A9 of the ring wave to 0.05mm / min and move down slowly, and stretch and deform the plate to the distance of about 0.5mm After the ring wave upper mold A9 and the ring wave lower mold A7 are bonded together, keep the pressure for 1min.

[0052] The cross-section of the deformed plate after drawing in pas...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
particle sizeaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a ring-wave repeated drawing high deformation mold and technology for a plate. The mold comprises two ring-wave mold bodies including the ring-wave mold body A and the ring-wave mold body B, wherein the two ring-wave mold bodies are both of an axially-symmetrical cylindrical structure, the upper surfaces and the lower surfaces of the ring-wave mold bodies are each composedof a plurality rings of convex-concave continuous alternate matchable ring waves, the ring wave radian and length of the axial center are large, the wave height of the axial center is small, and the ring wave radian and length are decreased ring by ring and the wave height is increased ring by ring from the axial center to the exterior. Ring-wave upper mold bodies are movable mold bodies, ring-wave lower mold bodies are fixed mold bodies, and two groups of positioning mechanisms which are radially and symmetrically arranged are arranged at the upper end of each ring-wave lower mold body; and the plate is drawn to be in a set ring wave shape by the ring-wave upper mold bodies and the ring-wave lower mold bodies through mold closing. According to the technology, crystal grains of the plate can be repeatedly drawn, deformed and refined through the mold, and then the size of the crystal grains reaches the micron grade or the submicron grade. The ring-wave repeated drawing high deformationmold is not limited by the plate size, a large-size plate can be machined, and the comprehensive properties of the plate on the physical aspect, the chemical aspect, the mechanical aspect and the likecan be greatly improved.

Description

technical field [0001] The invention relates to a metal material processing method and a processing mold. Background technique [0002] Strong deformation of plates is currently the mainstream process for refining plate grains and optimizing plate properties. Typical processes include cumulative lap welding, high-pressure torsion, constrained molding, and repeated wrinkling-straightening methods. Most of these methods are limited by the size of the material, it is difficult to prepare large-sized products, or the prepared materials have strong anisotropy. [0003] Professor Luo Junting of Yanshan University, aiming at the problems existing in the above-mentioned sheet metal forming process, proposed a sheet metal ring wave repeated drawing strong deformation mold and process, and applied for an invention patent (patent application number: 2016110779707). Wave mold, repeated forming to refine the grain of the plate, so that the grain size reaches micron or sub-micron level, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B21D13/02B21D37/10B21D43/00G06F17/50
CPCB21D13/02B21D37/10B21D43/003G06F30/17
Inventor 骆俊廷骆姝伊顾勇飞贾建波林启皓张春祥
Owner YANSHAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products