The invention discloses a repeated plate ring wave drawing intense deformation die and technology. The die comprises an upper ring wave die body and a lower ring wave die body, wherein the upper surface and the lower surface of the upper ring wave die body are formed by a plurality of circles of concave-convex, continuous, alternative and coincident ring waves, and the upper surface and the lower surface of the lower ring wave die body are formed by a plurality of circles of concave-convex, continuous, alternative and coincident ring waves. The upper ring wave die body is connected with a movable cross beam of a hydraulic machine. The lower ring wave die body is fixed to a working table board. The upper ring wave die body is a movable die, and the lower ring wave die body is a fixed die. Two locating mechanisms arranged symmetrically in the radial direction are arranged at the upper end of the lower ring wave die body and can locate a plate. The upper ring wave die body and the lower ring wave die body are guided through a guide column and a guide sleeve which are arranged symmetrically in the axial direction, and directly participate in formation of the plate. By means of die closing, the plate is drawn to a set ring wave shape. According to the technology, through the die, repeated drawing is carried out for deforming and refining plate grain particles to enable the size of the grain particles to reach the micrometer level or the sub-micrometer level, finally, a flattening die is used for flattening the deformed plate, and a smooth plate is obtained. The die is free of restrictions of the size of the plate, the plate in the large size can be machined, and the comprehensive performance of the aspects such as physics, chemistry and mechanics of the plate are improved greatly.