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High-throughput four-point-probe in-situ resistance measuring equipment for material chips

A technology of in-situ resistance and measurement equipment, applied in the direction of material resistance, etc., can solve the problems of in-situ measurement and recording, difficulty in coping with rapid resistance changes, long measurement intervals, etc., and achieve simple and convenient experimental assembly and connection process, interface Friendly, Inexpensive Effects

Pending Publication Date: 2018-02-23
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

To achieve this purpose, the traditional resistance measurement device usually uses a stepper motor-controlled probe to measure the resistance value of each area in sequence, but it is difficult to meet the requirements of in-situ measurement and recording, especially in the harsh environment of high temperature and high pressure. In addition, when the resistance change of the sample needs to be continuously recorded, the measurement interval for each sample is too long, and it is difficult to cope with the rapid change of resistance
In addition, currently domestic commercial four-probe test instruments are mostly single-channel, and the price of a single instrument is usually more than 5,000 yuan. If it is used for high-throughput resistance measurement, not only the cost is high, but also the connection is complicated.

Method used

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  • High-throughput four-point-probe in-situ resistance measuring equipment for material chips
  • High-throughput four-point-probe in-situ resistance measuring equipment for material chips
  • High-throughput four-point-probe in-situ resistance measuring equipment for material chips

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Embodiment 1

[0037] In this embodiment, a high-throughput method is used to screen a component with the smallest resistance temperature effect from a certain ternary material as an example to illustrate the research application of high-throughput in-situ resistance testing equipment. The concrete steps of this embodiment are as follows:

[0038] A1, choose the one prepared by the combined chip method, use a 3-inch quartz plate as the substrate, and coat the surface with 64 independent and different components of a certain ternary material film with a size of A×A (A=1~3mm). sample. Put it into the sample rack, adjust the position and fix it.

[0039] B1, the high-throughput four-probe probe is fixed to the sample holder with bolts. Since the sample preparation and the design of the probe adopt compatible dimensions, the probe tip of the probe can be in good contact with the appropriate position on the sample surface at this time.

[0040] C1, connect the cable plug of the four-probe probe...

Embodiment 2

[0048] In this embodiment, a high-throughput method is used to screen a component with the fastest hydrogen-sensing resistance response from certain ternary hydrogen-sensitive materials as an example to illustrate the research and application of high-throughput in-situ resistance testing equipment. The concrete steps of this embodiment are as follows:

[0049] A2, choose a 3-inch quartz plate prepared by the combination chip method, and the surface is coated with 64 ternary material films with a size of B×B (A=1~3mm) that are independent of each other and have different compositions. sample. Put it into the sample rack, adjust the position and fix it.

[0050] B2, the high-throughput four-probe probe is fixed to the sample holder with bolts. Since the sample preparation and the design of the probe adopt compatible dimensions, the probe tip of the probe can be in good contact with the appropriate position on the sample surface at this time.

[0051] C2, connect the cable plug...

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Abstract

The invention provides high-throughput four-point-probe in-situ resistance measuring equipment for material chips, and belongs to the technical field of material testing. The equipment comprises a high-throughput four-point-probe detector, a high temperature and high pressure resisting airtight tank, a sample rack, a multi-channel four-point-probe resistance tester, a transmission cable and data recording software. The sample rack is located in the high temperature and high pressure resisting airtight tank. The high-throughput four-point-probe detector is mounted on the sample rack, and is connected with the multi-channel four-point-probe resistance tester through the transmission cable. The data recording software is installed on an upper computer, and is used for receiving data measuredby the multi-channel four-point-probe resistance tester. The high-throughput four-point-probe in-situ resistance measuring equipment has the advantages that changes of four-point-probe resistors of asmuch as 64 samples along with changes of parameters such as time, air pressure and temperature can be measured and recorded in high-temperature high-pressure gas environments, and the equipment has high accuracy and reliability, high data collection frequency, low hardware cost and a simple operation method and can meet accurate measurement requirements on few sample resistors.

Description

technical field [0001] The invention relates to the technical field of material testing, in particular to a high-throughput material chip four-probe in-situ resistance measuring device. Background technique [0002] The material high-throughput experimental method in the Material Genome Project is an efficient method for the development of new materials. Its core idea is to complete the preparation and characterization of a large number of material samples in a short period of time, and to screen out samples that meet the performance requirements to correspond to the corresponding process. Compared with the traditional "trial and error method", the high-throughput test method has the advantages of short development cycle, low development cost, and low labor intensity. It is the cutting-edge technology in the development of current material research and application fields. [0003] Material combination chip technology is a method for high-throughput preparation of a large nu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/04G01N27/14
CPCG01N27/04G01N27/14
Inventor 李平谭奇伟安富强刘志伟曲选辉秦明礼
Owner UNIV OF SCI & TECH BEIJING
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