A filling and repairing method for adhesive repair

A technology of bonding and repairing pieces, which is applied in the field of filling and repairing for bonding repairs, can solve problems such as difficult control of digging and repairing angle accuracy, unfavorable engineering application, and affecting repairing effects, so as to overcome difficult control, improve repairing speed, reduce The effect of destruction

Active Publication Date: 2020-04-28
HEBEI UNIV OF TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, in the actual repair process, the accuracy of the cutout angle is not easy to control, which will cause changes in the shear stress and ultimately affect the repair effect
Therefore, the process of digging and mending requires high precision and complicated processing, which is not conducive to the application in actual engineering.

Method used

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  • A filling and repairing method for adhesive repair
  • A filling and repairing method for adhesive repair
  • A filling and repairing method for adhesive repair

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Embodiment Construction

[0022] The present invention will be further explained below in conjunction with the embodiments and accompanying drawings, but this should not be used as a limitation to the protection scope of the present application.

[0023] The present invention is a filling and repairing method (method for short, see Figure 2-3 ), the steps of this method are:

[0024] 1) Surface cleaning of the damaged area;

[0025] 2) According to the shape of the damaged area, use a rotary grinder to process the damaged area into a shape with a smooth boundary, no sharp corners and no stress singularity, so as to eliminate possible stress singularity, and the damaged area will be columnar after treatment. shape structure, determine the aspect ratio of the damaged area, and the smooth boundary refers to the boundary generated by rounded corner transition;

[0026] 3) Prepare a patch made of the same material as the motherboard. The thickness of the patch is the same as that of the damaged sunken ar...

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Abstract

The invention relates to a filling repair method used for adhesive bonding repair. According to the method, structure repair is completed by filling a clearance between a repair patch and a to-be-repaired material with an adhesive, the repaired structure is kept basically consistent with a structure not damaged in shape, no residual obstacle is formed near the repair region, the method is especially applicable to a structure with relatively high requirement on appearance, and the problem of patching angle does not need to be considered during filing repair, and therefore, damage to a mother board material and the difficulty of repair patch processing are reduced, and the repair work is simpler and faster.

Description

technical field [0001] The invention belongs to the technical field of material repair methods, and in particular relates to a filling repair method for adhesive repair, which is used for repairing metal or composite plate and thin shell structures that are not seriously damaged in use. Background technique [0002] Adhesive repair has the characteristics of high repair efficiency, simple and fast, and low cost, and is widely used in the repair of metal structures and composite material structures. CN201110044374.X discloses a method of digging and repairing local damage of carbon fiber reinforced resin-based laminates. The method is aimed at composite materials for digging and repairing. During the implementation process, the digging angle should be considered, as shown in Figure 1, by changing the size of the digging angle to control Bonded area and the amount of undamaged material removed. However, it is not easy to control the accuracy of the cutout angle in the actual ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B43/00F16B11/00
CPCB32B43/00F16B11/006
Inventor 刘桂荣段书用韩旭张湛明
Owner HEBEI UNIV OF TECH
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