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Vertical surface-mounting and packaging structure for components and process method of structure

A technology of packaging structure and process method, which is applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve the problems of easy collapse of connecting solder balls, multi-plane space, and low space utilization, so as to save plane space and improve The effect of integration level and package size reduction

Active Publication Date: 2018-02-27
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing passive components are mainly realized by surface mounting, which requires a lot of plane space; for POP stacked packages, the space between packages is usually less utilized, and the connecting solder balls between packages are easy to collapse when heated. Problems causing short bridging

Method used

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  • Vertical surface-mounting and packaging structure for components and process method of structure
  • Vertical surface-mounting and packaging structure for components and process method of structure
  • Vertical surface-mounting and packaging structure for components and process method of structure

Examples

Experimental program
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Effect test

Embodiment 1

[0037] Example 1: Component vertical mounting package structure

[0038] Such as figure 1 As shown, a component vertical mounting package structure in this embodiment includes a first package body 1, and the first package body 1 includes a first substrate 3, and the back of the first substrate 3 is provided with a first metal Balls 5 and passive components 6, the first package body 1 is mounted on the front of the second package body 2 through the first metal ball 5 and the passive component 6, the second package body 2 includes a conductive column 4, and the first package body 1 A package 1 is electrically connected to the second package 2 through the first metal ball 5, and the passive component 6 is vertically mounted and electrically connected through the first substrate 3 and the conductive column 4. The first metal ball 5 An underfill 7 is provided on the peripheral area of ​​the passive component 6 , and a second metal ball 8 is provided on the back of the second packa...

Embodiment 2

[0045] see Figure 6 , the difference between embodiment 2 and embodiment 1 is that there are vertically mounted passive components 6 and lateral passive components 9 between the first package body 1 and the second package body 2, and the vertical heights of the two are the same. The top of the element 6 is electrically connected to the first package body 1, and the bottom is electrically connected to the second package body 2. The lateral passive element 9 can be electrically connected to the first package body 1, or can be connected to the first package body 1 and the second package body 2. The second package body 2 is electrically connected.

Embodiment 3

[0047] see Figure 7 The difference between embodiment 3 and embodiment 1 is that the first package 1 is mounted on the surface of the second substrate 11 through the first metal ball and passive components, and the surface of the second substrate 11 is mounted with other required chips 10. The surfaces of the first package body 1 , the chip 10 , and the second substrate 11 are all encapsulated in a plastic encapsulant 12 .

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Abstract

The invention relates to a vertical surface-mounting and packaging structure for components and a process method of the structure. The structure comprises a first package body (1), the first package body (1) comprises a first substrate (3), the back surface of the first substrate (3) is provided with first metal balls (5) and the passive components (6), the first package body (1) is surface-mounted to the front surface of a second package body (2) through the first metal balls (5) and the passive components (6), the second package body (2) comprises conduction columns (4), the first package body (1) is electrically connected with the second package body (2) through the first metal balls (5), the passive components (6) are vertically surface-mounted and electrically connected with the conduction columns (4) through the first substrate (3), peripheral areas of the first metal balls (5) and the passive components (6) are provided with bottom filler adhesives (7), and the back surface of the second package body (2) is provided with second metal balls (8). The structure can be applied in POP packaging to fully utilize the space between every two adjacent package bodies and improve the integration level of products, so that the package bodies are higher in integration level under the same size.

Description

technical field [0001] The invention relates to a component vertical mounting packaging structure and a process method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] Current electronic products, especially consumer electronic products, are constantly developing in the direction of multi-function, high integration and miniaturization. For this reason, electronic products need to continuously reduce the overall size of the product while taking into account multiple functions. [0003] Existing passive components are mainly realized by surface mounting, which requires a lot of plane space; for POP stacked packages, the space between packages is usually less utilized, and the connecting solder balls between packages are easy to collapse when heated. Problems causing short bridging. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a component vertical mounting pack...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L23/64H01L23/31H01L21/50H01L21/56
CPCH01L21/50H01L21/56H01L23/3107H01L23/3128H01L23/64H01L25/16H01L25/162H01L2224/16225H01L2224/48091H01L2224/73204H01L2224/73265H01L2924/15311H01L2924/1533H01L2924/181H01L2924/00014H01L2924/00012
Inventor 梁新夫沈锦新孔海申周青云
Owner JCET GROUP CO LTD
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