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Method and device for releasing stress of flexible photovoltaic module packaging film

A photovoltaic module packaging and stress release technology, which is applied in photovoltaic power generation, chemical instruments and methods, electrical components, etc., can solve the problems of unpublished proposals, flexible module wrinkles, etc., achieve strengthening effects, ensure uniformity, improve efficiency and cut The effect of precision

Inactive Publication Date: 2018-03-06
MIASOLE EQUIP INTEGRATIONFUJIANCO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, flexible solar modules are an emerging product, and the industry has not yet proposed an effective solution to the problem of flexible module wrinkles

Method used

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  • Method and device for releasing stress of flexible photovoltaic module packaging film
  • Method and device for releasing stress of flexible photovoltaic module packaging film
  • Method and device for releasing stress of flexible photovoltaic module packaging film

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Embodiment Construction

[0052] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0053] Such as figure 1 As shown, the embodiment of the present invention provides a method for stress relief of flexible photovoltaic module encapsulation adhesive film, which includes the following steps:

[0054] S100, placing the film to be cut on the platform.

[0055] Specifically, step S100 specifically includes:

[0056] Place the film to be cut on the feeding mechanism.

[0057]Specifically, before step S100, it also includes:

[0058] S1. Roll the film into a cylindrical film roll.

[0059] S200, using a cutter to cut on t...

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Abstract

The invention discloses a method and a device for releasing the stress of a flexible photovoltaic module packaging film. The method includes the following steps: placing a to-be-cut film on a feedingmechanism; using a cutter to cut the film to form an oblique cut on the film; and starting the feeding mechanism, driving the to-be-cut film roll to move along the axial direction thereof in order tomove the cut out of the cutting position of the cutter, and moving the next to-be-cut position of the to-be-cut film roll to the cutting position. According to the method and the device for releasingthe stress of a flexible photovoltaic module packaging film provided by the invention, the stress and shrinkage of a packaging film can be released without changing the amount of packaging film material used, and the risk of wrinkles is reduced. Meanwhile, through automatic packaging film feeding, the efficiency and precision of packaging film cutting are improved, and the stress release effect isstrengthened.

Description

technical field [0001] The invention relates to the technical field of solar cell processing, in particular to a method for releasing stress of a flexible photovoltaic module encapsulation adhesive film and a device thereof. Background technique [0002] Compared with traditional rigid solar cell components, flexible solar cell components are thinner, bendable, and have a wider range of applications, but the appearance of flexible components is more sensitive to environmental temperature and humidity, lamination process, etc., and the shrinkage of flexible packaging materials The influence of rate, stress, and material-to-material matching makes the surface of flexible components easy to wrinkle, which seriously affects the appearance of components. [0003] During the lamination process of the component, the packaging material will shrink when heated due to its own stress. The larger the size of the component, the larger the size of the shrinkage of the packaging material; ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L31/048
CPCH01L21/67092H01L31/048B32B27/00Y02E10/50H10K30/88B65H20/02B65H35/04B65H43/00H01L21/67259
Inventor 李涛曾静刘林袁强孙士洋徐国军连重炎
Owner MIASOLE EQUIP INTEGRATIONFUJIANCO LTD
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