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Laser peeling and lamination integration device

A laser peeling and film sticking technology, which is applied in the directions of lamination devices, chemical instruments and methods, lamination auxiliary operations, etc. The effect of improving capacity utilization, reducing manufacturing costs and saving factory costs

Active Publication Date: 2018-03-09
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Among them, the laser stripping equipment is a single workpiece table, and the loading and unloading is a serial movement, and the stripping action takes about 4 seconds, which makes the utilization rate of the laser capacity low, and the excimer laser used in the existing laser stripping equipment is expensive and maintenance cost High, resulting in higher cost COO of laser stripping equipment
[0011] For flexible film lamination equipment, subject to flexible screen transmission and flexible screen film lamination process, the production cycle is about 10 seconds, which cannot meet the production line production cycle requirements
If simply increase the ratio of equipment, it will greatly increase the clean room area and factory costs

Method used

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  • Laser peeling and lamination integration device
  • Laser peeling and lamination integration device
  • Laser peeling and lamination integration device

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Embodiment Construction

[0047] The following will combine Figure 1 to Figure 10 The laser peeling and film sticking integrated device provided by the present invention is described in detail, which is an optional embodiment of the present invention. It can be considered that those skilled in the art can modify and modify it within the scope of not changing the spirit and content of the present invention. polish.

[0048] Please refer to Figure 4 , and in conjunction with other drawings, the present invention provides a laser peeling and film sticking integrated device, including:

[0049] Two laser peeling workpiece tables 407 of mirror image setting, please refer to Figure 5 , for receiving the hard screen to be peeled off from the feeding station and transporting the hard screen to be peeled off 403 to the stripping station in turn, and transporting the peeled hard screen to the handover station in turn;

[0050] To understand laser lift off, please also refer to figure 1, which is a laser s...

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PUM

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Abstract

The invention provides a laser peeling and lamination integration device. A laser peeling and lamination integration solution is realized, the capacity use ratio of the laser peeling system can be effectively improved, and production beat requirements can be achieved. In addition, the floor space and the factory overhead of a clean room can be saved, and flexible display manufacture cost is obviously lowered. Furthermore, in the scheme of the invention, the design of double laser peeling workbenches, double flexible screen platform deck rotary plate systems and double film carrying tables is further adopted, so that whole operation is not single-line operation, working efficiency is effectively improved, and manufacture cost is lowered.

Description

technical field [0001] The invention relates to OLED flexible display manufacturing technology, in particular to an integrated device for laser peeling and film sticking. Background technique [0002] Flexible display technology is one of the important development directions of OLED in the future. It has many advantages such as ultra-light, ultra-thin, rollable, portable, and impact-resistant. The preparation methods of FOLED include Roll to Roll (roll to roll) and Sheet to Sheet (sheet to sheet). The former has undergone major equipment transformation, and it is impossible to predict the mass production time. The latter is the mainstream of current technical research, and some manufacturers have already achieved mass production. [0003] In the sheet-to-sheet process, the flexible substrate needs to be bonded to the rigid carrier, which can then be processed using conventional equipment, and finally the flexible display on the rigid carrier substrate is released by a lift-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B38/10B32B37/00
CPCB32B37/0053B32B38/10
Inventor 覃宗伟张俊孟春霞周炯闻人青青李志丹
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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