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Packaging method of UVLED ceramic base and structure of UVLED ceramic base

A ceramic base and packaging method technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of large warpage of the UVLED ceramic base, difficult to achieve product air-tight packaging, and high manufacturing costs, and achieve high stability. performance and reliability, good sealing, optimized warpage

Inactive Publication Date: 2018-03-09
ZHEJIANG TC CERAMIC ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the problem that comes with it is that the warpage of the UVLED ceramic base is large, which will seriously affect its subsequent application in the UVLED packaging process, that is, the substrate is prone to cracking during UV LED packaging, and it is difficult to achieve airtight packaging of the product.
In addition, in order to ensure that the packaging frame and the ceramic metallized liner are tightly bonded, and a sufficient eutectic reaction occurs at the sintering temperature, the silver content in the solder layer paste is required to be ≥ 72wt%, but excessive silver content makes the manufacturing cost higher

Method used

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  • Packaging method of UVLED ceramic base and structure of UVLED ceramic base
  • Packaging method of UVLED ceramic base and structure of UVLED ceramic base
  • Packaging method of UVLED ceramic base and structure of UVLED ceramic base

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] An aluminum nitride ceramic substrate 110 with a size of 114.3 mm×114.3 mm is selected for use after ultrasonic cleaning treatment (pretreatment) is performed on its surface. The metal paste is printed on the surface of the ceramic substrate 110 by printing to form the metal layer 120 , thereby obtaining a precursor of the ceramic metal backing plate 140 . Wherein, the metal layer 120 includes 20% Ag, 73% Cu and 7% Ti by mass percentage.

[0045] A package ceramic frame 130 is provided on the package connection portion 122 of the metal layer 120 .

[0046] In this embodiment, the package ceramic frame 130 is aluminum nitride ceramic. The package ceramic frame 130 is preprocessed. Specifically, the sealing ceramic frame 130 is cleaned by ultrasonic waves and dried. Then the pretreated aluminum nitride package ceramic frame 130 is attached to the package connection portion 122 of the metal layer 120 .

[0047] Finally, the precursor of the ceramic metal liner 140 and ...

Embodiment 2

[0049] The metal-removing layer 120 includes 10% Ag, 87% Cu and 3% Ti by mass percentage, and the others are the same as in Embodiment 1.

[0050] Thus, the UVLED ceramic base of the present invention was prepared, and then related tests were performed on it. The test results are shown in Table 1.

Embodiment 3

[0052] Except that the metal layer 120 includes 30% Ag, 65% Cu and 5% Ti by mass percentage, and the package frame and the ceramic substrate are made of alumina ceramics, the others are the same as the embodiment 1.

[0053] Thus, the UVLED ceramic base of the present invention was prepared, and then related tests were performed on it. The test results are shown in Table 1.

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Abstract

The invention relates to a packaging method of a UVLED ceramic base and a structure of the UVLED ceramic base, and belongs to the field of LED packaging. The packaging method comprises the steps of arranging a metal layer on a ceramic substrate to obtain the precursor of a ceramic metal lining board, wherein the metal layer comprises a conducting circuit and a packaging connecting part configuredto surround the conducting circuit; attaching a packaging metal frame to the packaging connecting part and conducting the sintering operation. The structure of the UVLED ceramic base is packaged by adopting the above packaging method. On the basis of the inorganic packaging of the UVLED ceramic base, the ceramic material is selected as a packaging frame and the metal slurry with low silver contentis adopted. Therefore, the finally prepared UVLED ceramic base has the advantages of low warping degree, low manufacturing cost, high reliability and the like.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a method for packaging a UVLED ceramic base and a UVLED ceramic base structure. Background technique [0002] At present, the mainstream packaging method of LED is organic packaging, and the main packaging materials are mostly organic materials such as epoxy resin and silicone resin. If UV LEDs are also packaged with organic materials, due to the shorter wavelength of ultraviolet light and higher radiation energy, these organic materials are prone to aging when exposed to them for a long time, which will reduce the luminous efficiency of UV LED chips and affect their performance and life. Therefore, in order to solve the above problems, the industry proposes to use inorganic materials for packaging. One of the existing inorganic packaging technologies is to use post-firing technology, that is, to print a metal layer and a solder layer on the ceramic sintered substrate, and then attac...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/56
CPCH01L33/486H01L33/56H01L2933/0033
Inventor 于岩王太保刘深沈轶聪王顾峰黄世东胡士刚杨涛陈开康
Owner ZHEJIANG TC CERAMIC ELECTRONICS