Chip-level rotation modulation mems silicon micromachined gyroscope
A technology of rotation modulation and silicon micromechanics, which is applied in the fields of inertial technology and micro-electromechanical systems, can solve the problems of large volume, low integration, and high integration of gyroscopes, and achieve the effects of reducing volume, improving integration, and reducing volume
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[0017] refer to Figure 2-5 , the chip-level rotary modulation silicon micromechanical gyroscope in this embodiment, the glass sheet 1 used to support the base of the rotating platform is made of Pyrex7740, and the thickness is 300 μm, and the thickness of the first metal electrode 2 and the second metal electrode 3 are both 200nm, the material is gold; the SOI silicon wafer is crystal orientation, and the SOI device layer forms a micromechanical gyroscope 4, a wire group 5, a driving electrode 6, a driving detection electrode 7, a first sensitive detection electrode 8, and a second sensitive detection electrode 9. The thickness of the device layer is 30 μm, the micromechanical gyroscope 4 is a ring gyroscope, the gyroscope drive mode resonance frequency is 8 kHz, the sensitive mode frequency is 8.2 kHz, and the wire group 5 includes 8 wires, each of which has a width of 10 μm. The distance between the conductive wires above the torsion beam 12 is 5 μm. The driving electrodes...
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