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Chip-level rotation modulation mems silicon micromachined gyroscope

A technology of rotation modulation and silicon micromechanics, which is applied in the fields of inertial technology and micro-electromechanical systems, can solve the problems of large volume, low integration, and high integration of gyroscopes, and achieve the effects of reducing volume, improving integration, and reducing volume

Active Publication Date: 2021-03-23
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the disadvantages of large volume and low integration of existing rotary modulation gyroscopes, the present invention proposes a chip-level rotary modulation silicon micromechanical gyroscope to realize the integrated structure chip of a micro rotary modulation platform and a silicon micromechanical gyroscope. Only a few cubic millimeters, with the characteristics of small size and high integration

Method used

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  • Chip-level rotation modulation mems silicon micromachined gyroscope
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  • Chip-level rotation modulation mems silicon micromachined gyroscope

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Embodiment Construction

[0017] refer to Figure 2-5 , the chip-level rotary modulation silicon micromechanical gyroscope in this embodiment, the glass sheet 1 used to support the base of the rotating platform is made of Pyrex7740, and the thickness is 300 μm, and the thickness of the first metal electrode 2 and the second metal electrode 3 are both 200nm, the material is gold; the SOI silicon wafer is crystal orientation, and the SOI device layer forms a micromechanical gyroscope 4, a wire group 5, a driving electrode 6, a driving detection electrode 7, a first sensitive detection electrode 8, and a second sensitive detection electrode 9. The thickness of the device layer is 30 μm, the micromechanical gyroscope 4 is a ring gyroscope, the gyroscope drive mode resonance frequency is 8 kHz, the sensitive mode frequency is 8.2 kHz, and the wire group 5 includes 8 wires, each of which has a width of 10 μm. The distance between the conductive wires above the torsion beam 12 is 5 μm. The driving electrodes...

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Abstract

The invention discloses a chip-level rotating-modulation MEMS (micro-electromechanical systems) silicon micromechanical gyro and belongs to the field of inertial technologies and MEMS. The chip-levelrotating-modulation MEMS silicon micromechanical gyro comprises a base to support a rotary platform and maintain its rotation and an SOI (silicon on insulator) wafer; the base is composed of glass sheet 1 and first metal electrode 2 and second metal electrode 3 arranged on the upper surface of the glass sheet by sputtering; a micromechanical gyro 4, a wire unit 5, a drive electrode 6, a driving detection electrode 7, a first sensitive detection electrode 8 and a second sensitive detection electrode 9 are formed on a device layer of the SOI silicon wafer; a rotary modulation platform is formedon a base layer. The micromechanical gyro and its rotary modulation platform are integrally formed on different layers of the same SOI wafer, the size of the rotary modulating gyro is greatly decreased, and integrity is improved; compared with original like gyros, the chip-level rotating-modulation MEMS silicon micromechanical gyro is formed into the chip-level rotary modulating micromechanical gyro with the size decreased by about 2 magnitudes.

Description

Technical field: [0001] The invention relates to a MEMS silicon micromechanical gyroscope, which is used for measuring the rotational angular rate of an object and acquiring the attitude information of the object, and belongs to the fields of inertial technology and micro-electromechanical systems (MEMS). Background technique: [0002] Silicon micromachined gyroscope is an inertial device used to measure the angular rate of rotation of objects. It has important applications in navigation guidance, platform stability control, automotive industry, consumer electronics and other fields. The output drift of the silicon micromachined gyroscope is the most important index affecting the attitude error of the inertial navigation system, and it takes a lot of time and cost to significantly reduce the drift of the silicon micromachined gyroscope. At present, using the rotating platform to modulate the gyro output drift is an effective and fast method to significantly reduce the attitu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01C19/5656
CPCG01C19/5656
Inventor 苑伟政申强杨瑾周金秋谢建兵常洪龙
Owner NORTHWESTERN POLYTECHNICAL UNIV
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