Surface treatment method for growing graphene based on sapphire substrate
A surface treatment, sapphire technology, applied in the direction of graphene, nano-carbon, etc., can solve problems such as high cost, and achieve the effect of avoiding damage and simplifying complexity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0030] Embodiment 1: a concrete implementation step of the present invention is as follows:
[0031] 1) Put the sapphire substrate into acetone, absolute ethanol and deionized water in sequence for ultrasonic cleaning for 15 minutes, then take out the substrate and dry it with 99.999% high-purity argon;
[0032] 2) Put the treated sapphire substrate into the central area of the quartz reaction chamber 1, turn on the vacuum pumping device 5, pump the vacuum to 10Pa, then pass in argon gas to normal pressure, continue to vacuum to 10Pa, and repeat three times to remove the quartz the air in reaction chamber 1;
[0033] 3) Introduce hydrogen gas into the quartz reaction chamber 1 to etch the substrate surface, the gas flow rate is 30sccm, adjust the angle of the ball valve to keep the pressure in the tube at 100Pa, the etching temperature is 1100°C, and the etching time is 3h;
[0034] 4) After the etching is completed, wait for it to cool down to room temperature, respectivel...
Embodiment 2
[0041] Embodiment 2: another concrete implementation step of the present invention is as follows:
[0042] 1) Put the sapphire substrate into acetone, absolute ethanol and deionized water in sequence for ultrasonic cleaning for 20 minutes, then take out the substrate and dry it with 99.999% high-purity argon;
[0043] 2) Put the treated sapphire substrate into the central area of the quartz reaction chamber 1, turn on the vacuum pumping device 5, pump the vacuum to 10Pa, then pass in argon gas to normal pressure, continue to vacuum to 10Pa, and repeat three times to remove the quartz the air in reaction chamber 1;
[0044] 3) Introduce hydrogen gas into the quartz reaction chamber 1 to etch the substrate surface, the gas flow rate is 40 sccm, adjust the angle of the ball valve to keep the pressure in the tube at 100 Pa, the etching temperature is 1100 ° C, and the etching time is 2 hours;
[0045] 4) After the etching is completed, wait for it to cool down to room temperature...
PUM
| Property | Measurement | Unit |
|---|---|---|
| mean roughness | aaaaa | aaaaa |
| mean roughness | aaaaa | aaaaa |
| mean roughness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


