Multifunctional interface circuit based on integrated package
A multifunctional interface and circuit technology, applied in the field of electronic communication, can solve the problems of large space occupation, waste of resources, high cost, etc., and achieve the effect of reducing the use space, reducing the difficulty of use, and increasing the integration density
Active Publication Date: 2020-06-02
NO 24 RES INST OF CETC
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Problems solved by technology
In the conventional design, separate plastic or pottery-encapsulated devices are generally used for design according to the specific equipment. This kind of design often has a long cycle, high cost, and takes up a lot of space, resulting in a serious waste of resources.
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[0022] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0023] Such as figure 1 As shown, a schematic diagram of a multi-functional circuit structure provided by the present invention includes:
[0024] Integrated packaged level shifting unit, switch control unit, optocoupler signal isolation unit, LVDS transceiver unit, RS-422 communication interface transceiver unit, ARINC 429 bus interface transceiver unit, 1553B bus communication control unit, wherein each The functional units work independently without interfering with each other.
[0025] In this embodiment, there are 34 3.3V-5V level conversion units, 16 switching control units, 20 optocoupler units, 4 receiving and 1 sending LVDS transceiver units, 4 receiving and 4 sending RS-422 communication interface transceiver units, Both the ARINC 429 bus interface transceiver unit and the 1553B bus communication control unit are packaged in the...
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The invention, which belongs to the technical field of electronic communication, relates to an integrated-packaging-based multifunctional interface circuit. The circuit comprises a level conversion unit, a switching value control unit, an optocoupler signal isolation unit, an LVDS transceiver unit, an RS-422 communication interface transceiver unit, an ARINC 429 bus interface transceiver unit, anda 1553B bus communication control unit. On the basis of the integrated packaging, single-cavity multi-layer wiring integration of a plurality of components is realized; because all function units arepackaged into one cavity, compared with the existing packaging system structure, the circuit is integrated with multiple functions with a reduced circuit packaging dimension; and the requirement of the H standard military quality level in the GJB2438A-2002 "hybrid integrated circuit general specifications" can be met.
Description
technical field [0001] The invention belongs to the technical field of electronic communication and relates to a multifunctional interface circuit based on integrated packaging. Background technique [0002] A multi-functional interface circuit is mainly used for the communication of some large aviation equipment, such as aircraft, missiles, etc. In these devices, it usually involves using different interfaces for communication at different stages, such as aircraft takeoff, cruise, descent, missiles, etc. The initial stage, mid-flight and terminal stages, etc., the interfaces used include RS-422, ARIBC429, 1553B, etc., and may also include digital level conversion, LVDS conversion, digital signal isolation, etc. In the conventional design, separate plastic or pottery-encapsulated devices are generally used for design according to specific equipment. This kind of design often has a long cycle, high cost, and takes up a lot of space, resulting in a serious waste of resources. ...
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IPC IPC(8): G05B19/042
CPCG05B19/0423G05B2219/21119
Inventor 陈道远干旭春王国强
Owner NO 24 RES INST OF CETC