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Method for separating display module group from carrier substrate

A technology for carrier substrates and display modules, which is applied in the manufacture of electric solid devices, semiconductor devices, semiconductor/solid devices, etc., can solve problems such as damage to display modules, achieve smoothness, simplify separation steps, and avoid damage Effect

Active Publication Date: 2018-03-16
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the embodiment of the present invention provides a method for separating the display module from the carrier substrate and the carrier substrate, which solves the problem caused by the separation of the display module and the carrier substrate by using physical methods in the existing separation technology. damage

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  • Method for separating display module group from carrier substrate
  • Method for separating display module group from carrier substrate
  • Method for separating display module group from carrier substrate

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] figure 1 Shown is a schematic structural diagram of a carrier substrate equipped with a display module provided by an embodiment of the present invention, figure 2 Shown is a schematic flowchart of a method for separating a display module and a carrier substrate according to an embodiment of the present invention.

[0025] refer to figure 1 , the display module 1 and the carrier substrate 2 are bonded together through the adhesive layer...

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Abstract

The invention provides a method for separating a display module group from a carrier substrate. The display module group and the carrier substrate are bonded together by an adhesive. The carrier substrate comprises a plurality of through holes. The separation method includes: adhesive glue disintegrants are injected into a plurality of through holes of the carrier substrate; and after decomposition of the adhesive glue by the adhesive glue disintegrants, the display module group and the carrier substrate are separated. According to the embodiment of the invention, the adhesive glue disintegrants are injected into the through holes and the adhesive glue disintegrants are in contact with the adhesive glue to produce chemical reaction, so that the activity of the adhesive glue is reduced andthus the display module group is easy to separate from the carrier substrate. Compared with the conventional physical separation method, the chemical separation method based on the chemical reaction between the adhesive glue disintegrants and the adhesive glue enables the display module group to be protected from being damaged by the physical separation force; and the difficulty of bonding betweenthe carrier substrate and the display module group is also reduced.

Description

technical field [0001] The invention relates to the technical field of substrate separation, in particular to a method for separating a display module from a carrier substrate and the carrier substrate. Background technique [0002] When the substrate of the flexible display screen is PI (polyimide) or PET (polyethylene terephthalate) substrate, the screen will lack certain stiffness. Therefore, the use of flexible glass substrates (ie, ultra-thin glass) with better stiffness and optical properties has become a trend in the future development of flexible display substrates. The use of flexible glass as a substrate also requires a glass carrier substrate as a support. At present, most flexible glass substrates and glass carrier substrates are physically separated. When the flexible glass substrate is separated from the carrier substrate, it is necessary to use external force to separate them, that is, to apply mechanical force to separate the carrier substrate from the flexi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/00H01L51/56H01L21/683H10K99/00
CPCH01L21/6835H10K71/80H10K77/111H10K71/00Y02E10/549
Inventor 周丹丹芦宁隋鑫徐吉寅
Owner YUNGU GUAN TECH CO LTD
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