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Conical inductor packaging structure and packaging method thereof

A technology of packaging structure and inductance, applied in the direction of transformer/inductor parts, packaging/dipping, transformer/inductor shell, etc., can solve the problems that the inductance cannot meet the wide bandwidth, cannot be automated welding, and the assembly process is difficult. The effect of improving bandwidth, improving production efficiency, and reducing production costs

Active Publication Date: 2018-03-20
濮阳光电产业技术研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In microwave radio frequency circuits, it is usually necessary to select an inductor to isolate the radio frequency circuit and the DC power supply circuit to prevent mutual interference between signals. At the same time, microwave radio frequency circuits have the characteristics of wide bandwidth and high frequency. Ordinary inductors cannot meet the wide bandwidth. Requirements, so the tapered inductance is usually selected
Compared with ordinary inductors, tapered inductors can isolate radio frequency signals with a certain bandwidth due to their special geometric structures, but the bandwidth of tapered inductors mainly depends on their own geometric structures, which can be realized by adjusting the existing geometric structures. Wider bandwidth has certain limitations and difficulties
Moreover, the current tapered inductors are mainly produced by foreign manufacturers and most of them are "flying lead" structures. There are huge difficulties in the assembly process, and it is impossible to use the existing chip technology for automatic welding.

Method used

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  • Conical inductor packaging structure and packaging method thereof
  • Conical inductor packaging structure and packaging method thereof
  • Conical inductor packaging structure and packaging method thereof

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Embodiment Construction

[0015] As shown in Figure 1, it is a schematic diagram of a package structure of a tapered inductor provided by the present invention, which includes an upper wedge 1 and a lower wedge 2, and the upper wedge 1 and the lower wedge 2 are symmetrical Setting, the combination of the upper wedge 1 and the lower wedge 2 opens a hole to form a tapered cavity for placing the tapered inductor 3, and the lower surface of the lower wedge 2 is plated with electrode one 8 and electrode two 9 , the lower wedge is provided with a left through hole 6 and a right through hole 7, the pin one 4 and pin two 5 of the tapered inductance 3 pass through the left through hole 6 and the right through hole 7 respectively with the lower wedge The first electrode 8 on the lower surface of the body 2 is connected to the second electrode 9, and the first electrode 8 and the second electrode 9 are directly welded to the peripheral circuit. The upper wedge-shaped body 1 and the lower wedge-shaped body 2 are m...

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Abstract

The invention belongs to the field of microwave and component packaging, and particularly relates to a conical inductor packaging structure and a packaging method thereof. The conical inductor packaging structure comprises an upper wedge-shaped body and a lower wedge-shaped body which are arranged in a symmetrical mode, an upper wedge-shaped body and lower wedge-shaped body combination is providedwith a conical cavity which contains a conical inductor, the lower surface of the lower wedge-shaped body is plated with a first electrode and a second electrode, the lower wedge-shaped body is provided with a left through hole and a right through hole, a first pin and a second pin of the conical inductor are connected with the first electrode and the second electrode of the lower surface of thelower wedge-shaped body through the left through hole and right through hole respectively, and the first electrode and the second electrode are directly welded to a peripheral circuit. The packaging structure can change the bandwidth of the conical inductor on the condition that the geometric size of an existing conical inductor is not changed, and meanwhile the packaging structure can make the conical inductor welded through a surface-mount technology.

Description

technical field [0001] The invention belongs to the field of microwave and component packaging, and in particular relates to a packaging structure of a tapered inductor and a packaging method thereof. Background technique [0002] In microwave radio frequency circuits, it is usually necessary to select an inductor to isolate the radio frequency circuit and the DC power supply circuit to prevent mutual interference between signals. At the same time, microwave radio frequency circuits have the characteristics of wide bandwidth and high frequency. Ordinary inductors cannot meet the wide bandwidth. Requirements, so the tapered inductance is usually selected. Compared with ordinary inductors, tapered inductors can isolate radio frequency signals with a certain bandwidth due to their special geometric structures, but the bandwidth of tapered inductors mainly depends on their own geometric structures, which can be realized by adjusting the existing geometric structures. Wider band...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/02H01F27/29H01F41/00H01F41/10
CPCH01F27/022H01F27/292H01F41/005H01F41/10
Inventor 李国成李明闫海涛祝宁华
Owner 濮阳光电产业技术研究院