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LED packaging structure and method thereof

A technology of LED packaging and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting the heat dissipation effect, easy deformation, and small heat capacity of the metal heat dissipation substrate, so as to reduce the cost of aluminum materials, increase the heat dissipation effect, Improve the effect of glow dispersion

Inactive Publication Date: 2018-03-23
XIAN CREATION KEJI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. At present, most of the chips are packaged on a thin metal heat dissipation substrate. Because the metal heat dissipation substrate is thin, the heat capacity is small, and it is easy to deform, the contact between it and the bottom surface of the heat sink is not close enough to affect the heat dissipation effect.
[0006] 2. Since the light emitted by the LED light source is generally distributed in a divergent manner, that is, the Lambertian distribution, this causes the illumination brightness of the light source to be insufficiently concentrated, and generally requires secondary shaping through an external lens to meet the lighting needs of specific occasions, which increases production costs.

Method used

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  • LED packaging structure and method thereof
  • LED packaging structure and method thereof

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Embodiment 1

[0061] See figure 1 , figure 1 A schematic flow chart of an LED packaging method provided by an embodiment of the present invention, including:

[0062] S11, select the LED chip;

[0063] S12, selecting a heat dissipation substrate;

[0064] S13, welding the LED chip to the heat dissipation substrate;

[0065] S14. Prepare a first lens layer on the LED chip;

[0066] S15, sequentially intersecting and preparing a plurality of silica gel layers and lens regions on the first lens layer;

[0067] S16. Prepare an outer silica gel layer.

[0068]Specifically, the refractive index of the silica gel layer in the multi-layer structure increases sequentially, which can effectively suppress the total reflection of light, and the refractive index of the lens layer is greater than that of its adjacent silica gel layer, which can ensure that more LED chips can pass through the package. The material shines out.

[0069] Specifically, see figure 2 , figure 2 It is a schematic diag...

Embodiment 2

[0105] Further, please refer to Figure 4 , Figure 4 It is a schematic diagram of an LED package structure provided in another embodiment of the present invention. The LED package structure provided in this embodiment is prepared by the method provided in the first embodiment above. Specifically, the LED packaging structure includes: an LED base plate 21 , a first lens layer 22 , a first silicone layer 23 , a second lens layer 24 and a second silicone layer 25 from bottom to top.

[0106] Preferably, the LED bottom plate 21 includes a heat dissipation substrate and LED chips disposed on the heat dissipation substrate.

[0107] Further, the first lens layer 22 and the second lens layer 24 include several silicone hemispheres evenly distributed in the shape of a rectangle or a rhombus, wherein the silicone hemispheres may not be evenly distributed according to the process requirements.

[0108] Specifically, the second silica gel layer 25 has a hemispherical structure coverin...

Embodiment 3

[0126] Please refer to Figure 5 , Figure 5 The flow chart of the LED packaging method provided by another embodiment of the present invention, this embodiment is based on the above-mentioned embodiments, and the LED packaging method of the present invention is described in detail as follows. Specifically, include the following steps:

[0127] S21, selecting LED chips;

[0128] S22, selecting a heat dissipation substrate and a support;

[0129] S23. Welding the LED chip to the heat dissipation substrate;

[0130] S24. Prepare a plurality of lens regions and silica gel layers sequentially crossed on the LED chip;

[0131] S25. Baking at a temperature of 100-150° C. for 4-12 hours to complete the LED package.

[0132] Specifically, the LED chip is a blue LED chip.

[0133] Specifically, S22 may include:

[0134] S221, selecting a bracket and a heat dissipation substrate;

[0135] S222. Clean the support and the heat dissipation substrate;

[0136] S223, drying the bracke...

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Abstract

The invention relates to an LED packaging structure and a method thereof. The method comprises steps: S11, a blue light LED chip is selected; S12, a cooling substrate is selected; S13, the LED chip iswelded on the cooling substrate; S14, a first lens layer is manufactured on the LED chip; S15, multiple silica gel layers and lens areas are manufactured in a cross mode on the first lens layer; andS16, an external silica gel layer is manufactured. According to the LED packaging method provided in the invention, a multilayer structure with multiple lens areas and multiple silica gel layers is adopted in a light source; by using the characteristics that the refractive indexes of the silica gel layers in the multilayer structure are sequentially increased and the refractive index of a lens layer is larger than that of the adjacent silica gel layer, the light emission dispersion problem of an LED chip is improved, and light emitted by the light source is more concentrated; and besides, light of the LED chip can be ensured to be more irradiated through a packaging material.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to an LED packaging structure and a method thereof. Background technique [0002] At the end of the last century, the breakthrough of III-V compound semiconductors represented by GaN-based materials in the field of blue light chips brought about a revolution in lighting. The symbol of this revolution is the high-power light-emitting diode (Light-Emitting Diode, LED) Semiconductor lighting technology (Solid State Lighting, SSL) as the light source. [0003] LED has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. Under the background of increasingly serious environmental pollution, climate warming and increasingly tense energy sources, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/58H01L33/64
CPCH01L33/005H01L33/48H01L33/58H01L33/641H01L33/642
Inventor 张亮
Owner XIAN CREATION KEJI CO LTD
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