Fluid bearing cabinet and modular semiconductor processing equipment

Abstract

The invention discloses a fluid bearing cabinet and modular semiconductor processing equipment. The fluid bearing cabinet comprises a supporting frame and one or a plurality of drawing type single unit frames, wherein the supporting frame is provided with one or a plurality of accommodating spaces; each accommodating space is provided with an opening on the lateral surface of the supporting frame;each drawing type signal unit frame can bear a chemical fluid storage bottle; and the drawing type signal unit frames bearing the chemical fluid storage bottles are pushed into or drawn out of the corresponding accommodating spaces through the openings of the accommodating spaces. Compared with the prior art, the modular semiconductor processing equipment disclosed by the invention consists of aplurality of modules, and has the advantages of simple structure, convenience and flexibility for assembling, easiness for replacement, convenience for repair and the like. In addition, the chemical fluid storage bottles in the fluid bearing cabinet disclosed by the invention are very convenient to take out and put in, and the fluid bearing cabinet is easy to expand and convenient to use.

Description

【Technical field】 [0001] The invention relates to the field of semiconductor surface treatment, in particular to a modular semiconductor processing equipment and a fluid bearing cabinet for surface treatment of semiconductor wafers. 【Background technique】 [0002] At present, integrated circuits are gradually being applied to many fields, such as computers, communications, industrial control and consumer electronics. The manufacturing of integrated circuits has become a basic industry as important as steel. [0003] Wafers are the carriers used to produce integrated circuits. In actual production, the wafers that need to be prepared have a flat, ultra-clean surface, and the existing methods for preparing ultra-clean wafer surfaces can be divided into two categories: wet processes such as immersion and spray techniques, and processes such as Dry treatment process based on chemical vapor and plasma technology. Among them, the wet processing process is a relatively widely us...

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Problems solved by technology

[0004] However, the existing equipment for preparing ultra-clean wafer surfaces generally has the following disadvantages: 1. The structure is very complicated, the volume is relatively large, and the cost is also high; 2. Once these equipment fails, troubleshooting generally requires stopping the production line Production affects output; 3. Once the installation is completed, it is not easy to adjust and change the function and position; 4. It is inconvenient to carry

[0005] At present, the existing fluid carrying modules are all custom-made, and it is very inconvenient to take out and put in the chemical liquid storage bottle, and it is not easy to expand, not easy to move, and inconvenient to use

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