Chip heat dissipation structure in voice recognition device

A technology of chip heat dissipation and voice recognition, which is applied in the field of electric power, can solve problems affecting the operation of electric equipment, affecting the service life, and people's loss, and achieves the effects of good heat dissipation, normal operation, and shortened distance

Inactive Publication Date: 2018-04-10
成都海之译翻译有限公司
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a chip heat dissipation structure in a speech recognition device, which solves the problem that the chip will generate heat during operation. If the heat cannot be

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip heat dissipation structure in voice recognition device
  • Chip heat dissipation structure in voice recognition device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] Such as Figure 1-2As shown, the present invention provides a technical solution: a chip heat dissipation structure in a voice recognition device, including a housing 1, a storage battery 25 is provided on the upper surface of the outer wall of the housing 1, and a control panel 24 is provided on the upper surface of the storage battery 25. By setting the control panel 24, it is more convenient for people to control the working states of the first motor...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a chip heat dissipation structure in a voice recognition device. The chip heat dissipation structure comprises a shell, the upper surface of the outer wall of the shell is fixedly connected with a first fixing rod, and the top end of the first fixing rod is fixedly connected with the lower surface of a first driving device. The first driving device is meshed with a gear rod, and the bottom end of the gear rod is fixedly connected with the top end of a slide bar, a sliding sleeve is connected to the outer wall of the slide bar in a sleeved mode, the sliding sleeve is clamped on the upper surface of the outer wall of the shell, the bottom end of the sliding rod is fixedly connected with a first movable plate, and a first sliding block is fixedly connected to the leftside surface and the right side surface of the first movable plate. The chip heat dissipation structure in the voice recognition device is characterized in that a second motor, a third motor, a turntable, a pin shaft, a traction rope, a second movable plate, a spring and a telescopic rod work jointly, so that the heat dissipation of the chip body is realized, the situation that a chip body is damaged due to heating is avoided, and the service life of the chip body is guaranteed.

Description

technical field [0001] The invention relates to the field of electric power technology, in particular to a chip heat dissipation structure in a speech recognition device. Background technique [0002] A chip is an integrated circuit, which generally refers to all electronic components. It is a circuit module that integrates various electronic components on a silicon board to achieve a specific function. It is the most important part of electronic equipment, undertaking the functions of computing and storage. The application range of integrated circuits covers almost all electronic equipment for military and civilian use. [0003] The chip will generate heat when it is working. If the heat cannot be dissipated in time, it will definitely affect its normal operation, resulting in a decrease in speed and even affecting its service life, thereby affecting the operation of power equipment and bringing losses to people. inconvenience to life. Contents of the invention [0004...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K7/20
CPCH05K7/20136
Inventor 张斌张锋
Owner 成都海之译翻译有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products