Ultrashort pulse laser processing equipment for hard and brittle materials

Abstract

The invention discloses ultrashort pulse laser processing equipment for hard and brittle materials. The equipment comprises a rack, a worktable, a fixture, a laser module, and a three-dimensional motion mechanism moving in a first direction, a second direction and a third direction relative to the worktable; the first direction, the second direction and the third direction are pairwise perpendicular to each other; the worktable is mounted on the rack; the fixture is mounted on the three-dimensional motion mechanism; the laser module comprises a ultrafast laser, an optical module, a galvanometer and a field lens; the ultrafast laser and the optical module are mounted on the rack; and the galvanometer and the field lens are mounted on the three-dimensional motion mechanism. The problems of weak surface quality and serious edge breakage of the hard and brittle materials in traditional processing are solved; the processing process is optimized; subsequent processing procedures in traditional processing are reduced; the energy is saved; the equipment floor area is saved; such procedures as grinding in traditional processing are reduced; and the environmental protection effect is achieved.

Description

technical field [0001] The invention relates to the application field of ultrashort pulse laser, in particular to an ultrashort pulse laser processing equipment for hard and brittle materials. Background technique [0002] Ultrashort pulse laser belongs to cold laser processing. No heat is generated during the processing, which avoids the melting of the processed material, ensures the quality and dimensional accuracy of the processed surface, and can be completed in one step, with less follow-up processing procedures, saving processing time and improving processing efficiency. In addition, because the processing tool is light, it is a processing method without wear, so there is no change in processing effect due to tool attenuation. In contrast, thermal damage and tool wear in some mechanical micromachining modalities, as well as slower pulsed laser processing techniques, limit the precision that can be achieved and will require costly, time-consuming post-processing. Cont...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an ultrashort pulse laser processing equipment for hard and brittle materials, so as to improve the problems of low processing precision and low quality caused by traditional hard and brittle materials processed by cutting tools

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