Etching solution for glass substrate thinning technology
A glass substrate and etching solution technology, applied in the field of glass substrate thinning production, can solve the problems of high volatility, high toxicity of hydrofluoric acid, high risk, reduce toxicity, improve etching rate and etching effect, and be easily dissolved by water Effect
Inactive Publication Date: 2018-04-13
天津美泰真空技术有限公司
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Problems solved by technology
At present, the thinning etchant substrates used all use hydrofluoric acid as the main component, but hydrofluoric acid is highly toxic and volatile, especially when it needs to be prepared at a higher temperature and concentration, not only the production process High risk, and will cause huge pollution to the environment
Method used
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Embodiment 1
[0020] A glass substrate thinning process etchant, which is prepared from raw materials including the weight percentages shown in Table 1:
[0021] The formula of the etching solution of table 1 embodiment 1
[0022]
[0023]
Embodiment 2
[0025] A glass substrate thinning process etching solution, which is prepared from raw materials including the weight percentages shown in Table 2:
[0026] The formula of the etching solution of table 2 embodiment 2
[0027]
Embodiment 3
[0029] A glass substrate thinning process etching solution, the etching solution is prepared from raw materials including the weight percentages shown in Table 3:
[0030] The formula of the etching solution of table 3 embodiment 3
[0031]
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The invention provides an etching solution for a glass substrate thinning technology. The etching solution is prepared from the following raw materials in percentage by weight: 1 to 5 percent of HF (Hydrogen Fluoride), 10 to 25 percent of fluoride, 5 to 10 percent of strong acid, 1 to 5 percent of ethylenediamine tetraacetic acid (EDTA) or ethylenediamine tetraacetic acid salt (EDTA salt), 1 to 2percent of a surfactant, 1 to 2 percent of ethanol and the balance of water. According to the etching solution for the glass substrate thinning technology, a formula is optimized and the dosage of hydrofluoric acid is reduced; meanwhile, certain beneficial auxiliary agents are added, so that negative problems caused by the HF are avoided and an etching effect is good.
Description
technical field [0001] The invention relates to the technical field of glass substrate thinning production, in particular to an etchant for glass substrate thinning process. Background technique [0002] In the field of flat panel display, including plasma display, touch screen, liquid crystal display and other manufacturing processes, in order to further reduce the weight of display devices, more and more manufacturers adopt the method of thinning the glass substrate. There are usually two methods for glass substrate thinning, one is physical polishing and grinding, and the other is chemical etching thinning, among which chemical etching thinning is the most widely used. At present, the thinning etchant substrates used all use hydrofluoric acid as the main component, but hydrofluoric acid is highly toxic and volatile, especially when it needs to be prepared at a higher temperature and concentration, not only the production process The risk is high, and it will cause huge p...
Claims
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IPC IPC(8): C03C15/00
CPCC03C15/00
Inventor 张杰沈励郑建军姚仕军夏伟吴青肖
Owner 天津美泰真空技术有限公司
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