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Dip plate with variable cavity depth and method for dipping contact terminals of electronic components

A technology of electronic components and contact interfaces, which is applied in the field of DIP boards, can solve the problems of limiting the maximum size of electronic components, etc., and achieve the effects of simple cost, avoiding overflow, and low cost

Inactive Publication Date: 2018-04-17
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the disadvantage of these DIP boards is that since each cavity is different, it limits the maximum size of the electronic components that can be wetted

Method used

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  • Dip plate with variable cavity depth and method for dipping contact terminals of electronic components
  • Dip plate with variable cavity depth and method for dipping contact terminals of electronic components
  • Dip plate with variable cavity depth and method for dipping contact terminals of electronic components

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Embodiment Construction

[0088] figure 1 A first state of a first preferred embodiment of the DIP-panel according to the invention is schematically shown in side view. The DIP board 1 has a plate-shaped base body 4 with an upper side 5 and an underside 6 . A recess 7 that is open toward the upper side 5 is provided in the base body 4 . The cavity plate 9 is movably arranged in this recess 7 . The cavity plate 9 is movable over the path section S between the upper side 5 and the lower side 6 . For moving the cavity plate 9 , the DIP plate 1 has a drive 10 which is arranged between the base body 4 and the cavity plate 9 . Furthermore, the cavity plate 9 is fastened to the base body 4 via a sealing device 12 designed as a flexible region 13 and is sealed against this base body. Between the upper side 5 and the cavity plate 9 , the recess 7 is thus formed as a cavity 8 with a cavity depth T for receiving the solder F. FIG. The cavity 8 is completely filled with the flux F. FIG. The base body 4 is mo...

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Abstract

The invention relates to a DIP plate (1) used for DIP technique so as to facilitate using a solder (F) to infiltrate a contact interface (2) of an electric element (3). The DIP plate (1) is provided with a substrate (4) having an upper side (5), a lower side (6) and at least one recess (7) opening towards the upper side (5). The recess (7) extends from the upper side (5) along the direction of thelower side (6). The recess (7) is locally provided with a cavity (8) used for accommodating the solder (F). According to the invention, a cavity plate (9) of the DIP plate (1) is at least partly arranged in the at least one recess (7) and the at least cavity (8) can be fixed by the aid of the cavity plate (9) towards the lower side (6) of the substrate (4). The cavity plate (9) is movable in a segment (S) at least along the upper side (5) to the lower side (6). Besides, the invention also relates to a DIP device, an automatic assembly machine and a method for infiltrating the contact interface (2) of an electronic part (3) in the solder (F).

Description

technical field [0001] The invention relates to a DIP board for the DIP process in order to wet the contact interfaces of electronic components with solder. Furthermore, the invention relates to a DIP device for the DIP process in order to wet the contact interfaces of electronic components with solder, to an automatic assembly machine with electronic components for assembling circuit boards, and to a A method of wetting the contact interfaces of electronic components in solder. Background technique [0002] In the surface mount device manufacturing process (SMD manufacturing), SMD components are positioned on the surface of the circuit board and connected directly to this surface by soldering. For this purpose, the SMD components have contact interfaces which can be soldered to corresponding connection interfaces of the printed circuit board. In order to ensure an error-free and thus reliable soldering position as far as possible, it is advantageous if the contact interfa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/34H05K2203/044H05K3/3489B23K1/203B23K1/0016H05K3/3405H05K3/3421
Inventor 阿诺·斯坦恩托马斯·利贝克克里斯托夫·菲舍尔
Owner ASM ASSEMBLY SYST GMBH & CO
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