Efficient heat radiation packaging structure based on graphene thermal interface layer and manufacturing method thereof

A technology of heat dissipation structure and graphene layer, applied in semiconductor/solid state device manufacturing, electrical components, electric solid state devices, etc., to achieve the effect of improving thermal management efficiency, great application value, and improving heat dissipation efficiency

Active Publication Date: 2018-04-20
NAT CENT FOR ADVANCED PACKAGING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But so far no one has found a good heat dissipation structure of graphene materials for the field of integrated circuit packaging

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  • Efficient heat radiation packaging structure based on graphene thermal interface layer and manufacturing method thereof
  • Efficient heat radiation packaging structure based on graphene thermal interface layer and manufacturing method thereof
  • Efficient heat radiation packaging structure based on graphene thermal interface layer and manufacturing method thereof

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Embodiment Construction

[0024] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0025] In this specification, reference to "one embodiment" or "the...

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Abstract

The present invention discloses a heat radiation structure based on a graphene thermal interface layer. The structure comprises: multiple graphene layers, wherein each graphene layer has thickness andthe same length and width; multiple bonding layers, wherein each bonding layer has a thickness and one length and one width being the same as these of the graphene layers, the bonding layers and thegraphene layers alternatingly form a stacked structure, the stacked structure is subjected to spiral turning by taking a width direction as a shaft in a length direction starting from one end of the stacked structure to form a cylindrical spiral coil, the top surface and the bottom surface of the spiral coil are planes formed by spiral turning of two opposite thickness surfaces of the multiple graphene layers and the multiple bonding layers. The efficient heat radiation packaging structure based on the graphene thermal interface layer and the manufacturing method thereof effectively utilize graphene high-surface inner thermal conductivity and achieve efficient heat radiation packaging.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a high-efficiency heat dissipation packaging structure based on a graphene thermal interface layer and a manufacturing method thereof. Background technique [0002] With the continuous development of integrated circuit technology, the performance of integrated circuit chips is constantly improving. The heat dissipation problem of high-integration, high-performance, and high-power chips is becoming more and more important. The rise of chip temperature will affect the performance of devices. work performance, shorten the working life of the device, and even cause direct damage to the device due to high temperature. [0003] The heat dissipation design in packaging technology is directly related to the heat dissipation effect of the overall chip system. The purpose of the heat dissipation design is to obtain a lower operating temperature and an effective heat di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L21/48
CPCH01L21/4871H01L23/3735H01L23/3738H01L2224/16225H01L2224/73253H01L2924/15311H01L2924/16152
Inventor 曹立强孙鹏
Owner NAT CENT FOR ADVANCED PACKAGING
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