The present invention provides a method for manufacturing a
satellite navigation three-dimensional
chip, and relates to the field of three-dimensional
chip manufacturing. The method is based on a method for manufacturing a
satellite navigation three-dimensional
chip, and includes: S1. First, three-dimensional structure design is performed using professional
design software, and the optimization of
electrical performance, thermal management and physical size is considered.
Silicon via technology is used to achieve vertical integration between chip
layers to ensure rapid
signal transmission and high-density integration. At the same time,
graphene and
carbon nanotube composite materials are selected to prepare high
thermal conductivity nanomaterials for use as thermal interface materials. By using professional
design software for three-dimensional structure design and using
silicon via technology to achieve vertical integration between chip
layers, this solution can ensure rapid
signal transmission and high-density integration, and
graphene and
carbon nanotube composite materials are selected as thermal interface materials. Combined with a carefully designed heat
diffusion layer
layout and micro-cooling channels, the thermal
management efficiency of the chip is significantly improved.