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29results about How to "Improve thermal management performance" patented technology

Hybrid power device with power recovery function

ActiveCN224392376UOptimize power distributionEliminate transmission backlashElectrodynamic brake systemsGearingDrive shaftControl theory
The utility model relates to vehicle energy recovery device technical field especially discloses a hybrid device with power recovery function, including engine, the drive shaft that coordinates with engine and the electric power generation all -in -one that is connected with drive shaft, electric power generation all -in -one is connected with electric energy storage module, still include worm and worm mechanism, shunt hybrid mechanism and transmission mechanism, transmission mechanism linkage shunt hybrid mechanism and worm and worm mechanism parallel operation hybrid mechanism and electric power generation all -in -one, the input of worm and worm mechanism is connected with the output of engine, shunt hybrid mechanism has two shunt input ends that are connected with worm and worm mechanism and electric power generation all -in -one coordination respectively, shunt hybrid mechanism is driven axle and vehicle's wheel system transmission connection, in the process that vehicle decelerates or brakes, the inertia braking moment of wheel system is driven electric power generation all -in -one and generates electricity via shunt hybrid mechanism, and the electric energy that electric power generation all -in -one generates is stored via electric energy storage module.
Owner:SHENZHEN TONGDA ALISON IND CO LTD

A high precision rgb edge emitting laser lamp cluster module

ActiveCN224458938UImprove optical path accuracyImprove structural stabilityManufacturing cost reductionOptical integration
The utility model discloses a kind of high-precision RGB edge-emitting laser lamp group module, it is related to optoelectronic packaging technical field, including copper substrate, the top of copper substrate is fixedly connected with chip bracket, the top of chip bracket is fixedly connected with several T table type silicon prism, the top of chip bracket is fixedly connected with edge-emitting laser chip assembly, the top of copper substrate is installed with glass optical window, the bottom of glass optical window is coated with metal plating, the device is through structural integration design, optical integration optimization and all inorganic packaging process, effectively improve the light path precision of edge-emitting laser chip assembly, structural stability, packaging reliability and thermal management performance, while significantly improve the automation assembly efficiency and reduce manufacturing cost, especially suitable for high-resolution display, complex environment lighting and laser system in the scene with higher precision and reliability requirement.
Owner:SAIHAN SEMICONDUCTOR (SUZHOU) CO LTD

A continuous-pulse column vector fiber laser cleaning system

PendingCN122076768AUniform energy injectionConsistent energy injectionCleaning processes and apparatusGaussian beamControl system
This invention discloses a continuous-pulse column vector fiber laser cleaning system, comprising a laser generation module, a beam transmission and scanning module, and a motion control module. The laser generation module employs a continuous-pulse column vector laser, which integrates a control module capable of switching between continuous and pulsed output modes. It also integrates a polarization control system capable of freely switching between radial and angular polarization modes according to cleaning process requirements, and selecting to emit either a radially or angularly polarized beam. Within the reliable architecture of a time-sharing hybrid cleaning system, this laser cleaning system utilizes the unique spatial polarization and energy distribution characteristics of a column vector beam to replace the traditional fundamental mode Gaussian beam, achieving a significantly improved advanced laser cleaning system in terms of cleaning quality, process versatility, and overall efficiency.
Owner:BEIJING UNIV OF TECH

A winding inductance heat transfer encapsulation structure and method

The application discloses a winding inductance heat transfer pouring structure and method, which comprises a substrate, a heat conduction column is vertically arranged on the upper end surface of the substrate, a winding inductance is sleeved on the heat conduction column and located at the bottom of the substrate, a pouring cavity is arranged between the winding inductance and the heat conduction column, a pressing plate is detachably connected to the top of the winding inductance, a plurality of pouring openings are formed in the pressing plate and communicated with the pouring cavity, the winding inductance comprises an inductance magnetic ring, a first insulating film wrapped on the inductance magnetic ring, a second insulating film wrapped on the first insulating film and an inductance winding wound on the inductance magnetic ring, the inductance winding is located between the first insulating film and the second insulating film, and a plurality of pouring holes are formed in the first insulating film and the second insulating film and communicated with the pouring cavity. The application improves the heat dissipation efficiency and heat transfer capacity of the winding inductance and effectively solves the problem of heat accumulation of the winding inductance.
Owner:XIAN MICROELECTRONICS TECH INST

Space expandable photoelectric information processing device

PendingCN122662109ADealing with complexityRespond to diverse needsInformation processingInformation networks
The application relates to the field of high-speed communication and information network technology, in particular to a space expandable photoelectric information processing device, which comprises a device body, the device body comprises a power board module, an information processing board module, an interface board module, an expansion information processing module and a processing board heat dissipation top cover, a shielding block is arranged in the interface frame, and the device body comprises the processing board heat dissipation top cover. The application can not only improve the complex processing technology, overcome the deficiencies of the existing technology in the aspects of efficiency, cost, precision, material utilization rate, environmental protection and the like, improve the modularization and expandability of the system, improve the photoelectric data processing capacity, realize high integration and small and light design, help improve the heat dissipation performance and environmental adaptability of the device, and help unify the information processing of multiple types of photoelectric loads.
Owner:ZHUHAI ORBITA AEROSPACE SCI TECH CO LTD

A multi-modal fluid-structure coupling hierarchical heat dissipation fan module and a thermal management method thereof

PendingCN122513962AImprove cooling effectImprove thermal management performance
This invention relates to the field of thermal management technology, and more particularly to a multimodal fluid-structure interaction (FSI) graded cooling fan module and its thermal management method. Its features include a stepped heat-conducting block with an embedded oscillating heat pipe, a sandwich-locked fan on the side of the stepped heat-conducting block, and a rectifier ring surrounding the stepped heat-conducting block. The blade tips of the sandwich-locked fan are connected to the side of the stepped heat-conducting block and are invertedly positioned around the oscillating heat pipe. The sandwich-locked fan is connected to a motor that drives its rotation. Through multimodal coupling, it improves thermal management efficiency; it employs a biomimetic leaf vein-like capillary structure to achieve efficient working fluid circulation in a small space, and, combined with centrifugal force, ensures stable working fluid reflux at high speeds; its modular design and efficient heat dissipation capabilities allow the thermal management system to achieve good heat dissipation at lower fan speeds, effectively reducing overall system energy consumption and noise.
Owner:NORTHWESTERN POLYTECHNICAL UNIV +1

A multi-modal fluid-structure coupling hierarchical heat dissipation fan module and a heat dissipation method thereof

PendingCN122294462AImprove thermal management performanceEnsure the stability of working fluid backflowWorking fluidCooling effect
This invention relates to the field of thermal management technology, and more particularly to a multimodal fluid-structure interaction (FSI) graded cooling fan module and its cooling method. It includes a sandwich-structured stationary wheel, a flow-guiding coupling wheel, and a sandwich-structured moving wheel, all coaxially arranged, with a phase change material filling the spaces between them. The sandwich-structured moving wheel is mounted on the upper end of the shaft, and the flow-guiding coupling wheel is also located at the lower end of the shaft. The sandwich-structured stationary wheel is positioned below the flow-guiding coupling wheel. Through multimodal coupling, thermal management efficiency is significantly improved; a biomimetic leaf-vein-like capillary structure achieves efficient working fluid circulation in a small space, and combined with centrifugal force, ensures the stability of working fluid reflux at high speeds; it features both self-driven and forced-driven modes, automatically matching the cooling intensity according to the heat source load to achieve good cooling effects, and supports heat recovery, reducing overall system energy consumption and noise; through modular design, assembly is convenient, and it is suitable for the thermal management needs of high-power-density equipment.
Owner:NORTHWESTERN POLYTECHNICAL UNIV +1

Cooling and lubricating system of hybrid architecture and vehicle

ActiveCN224079566Ueasy to combineSolve various technical contradictions that existGear lubrication/coolingThermodynamicsActive cooling
The utility model provides a cooling and lubricating system of a hybrid framework and a vehicle. The system comprises a driving lubricating oil channel, a branch oil channel, a first cooling cavity, a second cooling cavity, an oil discharge channel, an oil suction port and an oil cooling circulation mechanism. The active lubricating oil channel is communicated with the first cooling cavity, and the active lubricating oil channel and the first cooling cavity are combined to form an active cooling and lubricating framework; the branch oil duct is communicated with the second cooling cavity, and the branch oil duct and the second cooling cavity are combined to form a passive cooling lubricating framework; the oil discharge channel is communicated between the first cooling cavity and the second cooling cavity, and excessive oil in the second cooling cavity flows to the first cooling cavity through the oil discharge channel; the oil suction port is formed in the bottom of the first cooling cavity, one end of the oil cooling circulation mechanism communicates with the oil suction port, and the other end of the oil cooling circulation mechanism communicates with the driving lubricating oil channel and the branch oil channel.
Owner:ZERON AUTOMOBILE TECHNOLOGY CO LTD

An intelligent driving vehicle controller integrated installation structure

ActiveCN224611021UClear space layoutCompact and reasonable structure
The utility model discloses an integrated installation structure of intelligent driving vehicle controller belongs to heavy truck technical field, including ADU wisdom driving controller, VCU whole vehicle controller and ADU water -cooling controller, the lower part of VCU whole vehicle controller and ADU water -cooling controller is fixed in the two upper beam frames of left and right symmetry and parallel, the lower part of ADU wisdom driving controller is fixed in the two lower beam frames of left and right symmetry and parallel, the upper beam frame is located the top of lower beam frame and both sides are connected through the side support of inverted U shape, VCU whole vehicle controller, ADU water -cooling controller with ADU wisdom driving controller form the upper and lower layer distribution and form the heat dissipation space in the middle. This controller integrated installation structure not only has optimized space layout and heat dissipation effect, still has promoted assembly efficiency, assembly quality and system maintainability greatly, has overcome the technical problem of many aspects such as the structure dispersion, the installation complicated, the heat dissipation is limited in prior art.
Owner:BEIJING FOTONDAIMLER AUTOMOTIVE

Battery pack

PendingCN122512056AImprove thermal management performanceExtended service life
This application relates to the field of battery technology, and more particularly to a battery pack. The battery pack includes a housing, a cover, a heat spreader, a cooling component, and multiple battery cells. The housing has mounting slots; the cover is located at the opening of the mounting slot; each battery cell is spaced apart in the mounting slot, and each cell has a shoulder at the end furthest from the bottom of the slot; the heat spreader connects to each shoulder; the cooling component is located on the side of the heat spreader facing away from the shoulder, and a cooling channel is formed inside the cooling component, through which a cooling medium flows to achieve heat exchange with the heat spreader. This battery pack, by incorporating a combined heat dissipation structure of a heat spreader and a cooling component at the shoulder, firstly achieves targeted heat dissipation in this core heat-generating area, reducing heat accumulation at the shoulder from the source, avoiding the generation of thermal island effects, effectively improving the overall thermal management performance of the battery pack, slowing down cell aging, and extending the battery pack's service life.
Owner:CHONGQING LANDIAN AUTOMOBILE TECHNOLOGY CO LTD

Manufacturing method of non-circular section core hot partition potting thin film capacitor

ActiveCN121964379ARealize intelligent outputStable core structureThin/thick film capacitorFixed capacitor housing/encapsulationThermodynamicsHeat management
The embodiment of the invention provides a manufacturing method of a non-circular section core hot partition potting film capacitor, and the method comprises the steps: determining the dielectric film thickness of a metallized film, the sheet resistance of a metallized electrode, and a winding tension window according to the obtained working condition of the capacitor; performing multi-layer continuous winding on the metalized film along the radial direction of the mandrel of the non-circular structure to obtain an initial capacitor core with a non-circular cross section; performing metal paint spraying and crimping treatment on the initial capacitor core with the non-circular cross section to form an end face electrode, completing fixation of a leading-out terminal, and obtaining a capacitor core led out by the end face electrode; based on the capacitor core, obtaining core non-circular cross section geometric characteristic parameters, the number of layers of a metallized film and a target working frequency; and carrying out hot zoning through presetting a hot zoning intelligent discrimination neural network model, and determining an encapsulation material zoning distribution scheme, thereby carrying out zoning pouring and radial heat dissipation path construction, and obtaining a final capacitor. According to the scheme, the heat management efficiency can be improved.
Owner:SHENZHEN SINCERITY TECH

A connector for charging and swapping new energy vehicles

This utility model discloses a connector for charging and swapping new energy vehicles. The connector includes a connector housing, within which a signal connection terminal is located. High-voltage terminals are located on both sides of the signal connection terminal within the connector housing. A protective portion for enclosing the high-voltage terminals is provided on the back of the connector housing. A heat-conducting sleeve is provided within the protective portion and fitted onto the outer wall of the high-voltage terminals. The inner wall of the heat-conducting sleeve has several equally spaced heat-conducting sections embedded in the outer wall of the high-voltage terminals. The outer wall of the heat-conducting sleeve has several heat-dissipating fins evenly distributed along the circumference, passing through the protective portion. The heat-conducting sections increase the contact area between the heat-conducting sleeve and the high-voltage terminals, improving heat conduction efficiency. The heat-dissipating fins increase the contact area with air, enhancing heat exchange capacity. The guide channel structure expands the contact range between the heat-conducting sleeve and air, preventing heat accumulation and improving overall heat dissipation performance.
Owner:WENZHOU GUOYE ELECTRONIC TECH CO LTD

A high efficiency SiP power module

PendingCN122119315AImprove thermal management performanceImprove running stabilityTemperatue controlPower conversion systemsCapacitanceMOSFET
The application relates to the technical field of semiconductor devices, in particular to a high-efficiency SiP power module which comprises a ceramic substrate, a metal frame, a metal cover plate and a plurality of power units; each power unit comprises a MOSFET, a transformer, a high-voltage capacitor and a high-voltage diode, an NTC thermistor, a PTC thermistor, an electrically-controlled variable resistor, a voltage-dividing resistor, a filter capacitor and a micro MCU; the NTC thermistor is connected in series on a source path of the MOSFET and is connected through a voltage-dividing circuit and the micro MCU; the PTC thermistor is connected in parallel with the source and the drain of the MOSFET; the micro MCU outputs a resistance value adjustment amount of the electrically-controlled variable resistor by analyzing voltage and resistance change conditions in the circuit, and adjusts the resistance value of the electrically-controlled variable resistor by using the resistance value adjustment amount. The application improves the heat management capability of the SiP power module and avoids local temperature imbalance.
Owner:XIAN YINGRAN SEMICON TECH CO LTD

Battery lower case, battery case, battery pack, and vehicle

ActiveCN224417915Ureduce weightReduce cooling capacityHeat managementElectrical battery
The application discloses a battery lower box, a battery box, a battery pack and a vehicle. The battery lower box comprises a shell and a flow channel plate. The shell comprises a bottom shell wall and a side shell wall arranged on the side of the bottom shell wall. The flow channel plate is a non-metal flow channel plate. The flow channel plate is located on the side of the bottom shell wall away from the side shell wall, and the flow channel plate is fixedly connected with the bottom shell wall. The battery lower box can reduce the weight and improve the thermal management effect on the battery cell through structural optimization.
Owner:BEIJING CHEHEJIA AUTOMOBILE TECH CO LTD

Battery module and electric device

The utility model discloses a battery module, and relates to the technical field of batteries. The battery module comprises a box body, more than two battery packs and an isolation body, the at least two battery packs are arranged in the box body and are arranged at intervals in the first direction, each battery pack comprises a plurality of single batteries arranged in the second direction, and a first gap exists between every two adjacent battery packs; the isolator is arranged in the first gap. The isolators are arranged between every two adjacent battery packs, the isolators can help to control conduction and diffusion of heat, the adjacent battery packs are prevented from being affected by overheating of one battery pack, and therefore the heat management performance of the whole module is improved.
Owner:SUNGROW POWER SUPPLY CO LTD

A flexible functional composite material with excellent thermal management capabilities and its preparation method

ActiveCN121108745Bimproved thermal managementExcellent thermal buffer performanceHexagonal boron nitrideMicrosphere
This invention provides a flexible functional composite material with excellent thermal management capabilities and its preparation method. It mainly comprises the following key components: a polydimethylsilane (PDMS) matrix material, a hexagonal boron nitride (h-BN) thermally conductive material, and a microencapsulated phase change microsphere (MPCM) thermal storage material with melamine-formaldehyde resin as the shell and n-eicosane as the core material. The preparation method involves only simple stirring, heating, and curing, and based on the crosslinking inhibition mechanism and external force constraints, it is possible to prepare flexible functional composite materials with high filler concentrations. The flexible functional composite material of this invention exhibits excellent mechanical and thermal management properties. The thermally conductive phase material can rapidly transfer heat flow, improving the heat absorption efficiency of the thermal storage phase material, while the thermal storage phase material can rapidly absorb heat, promoting temperature reduction. This invention is simple to prepare and has superior performance, showing promising application prospects in fields such as electronic skin, electronic devices, and advanced fabrics.
Owner:TONGJI UNIV

New energy automobile power battery pack reinforcing beam

The utility model belongs to new energy automobile battery technical field belongs to, disclose new energy automobile power battery package reinforcing beam, including square frame cover, square frame cover is by a plurality of upper beams, a plurality of lower beams, a plurality of left beams, a plurality of right beams the frame structure of composition;Upper beam installs on battery package upper cover top;Lower beam installs in battery package tray below;Left beam and right beam and fixed mounting on battery package shell, battery package tray;In square frame cover bottom surface setting a plurality of mutually connected W shape's liquid cooling pipeline no.
Owner:JIANGSU MINGRU PRECISION MOULD CO LTD

Circuit board heat dissipation components and their preparation methods, energy storage systems

ActiveCN122121046BSmall reboundreduce warpageThermodynamicsLiquid state
This invention relates to the field of energy storage technology, particularly to circuit board heat dissipation components and their manufacturing methods, as well as energy storage systems. The circuit board heat dissipation component includes a circuit board, a frame, thermally conductive adhesive, and functional components. The circuit board includes a substrate and electronic components, with the substrate having a heat dissipation area. The frame forms a heat dissipation cavity. The functional components and the circuit board respectively seal a first opening and a second opening of the heat dissipation cavity, with the heat dissipation area connected to the heat dissipation cavity. The thermally conductive adhesive is configured to be injected into the heat dissipation cavity through the first or second opening in a liquid state and then solidify, fixing the thermally conductive adhesive to both the heat dissipation area and the functional components. When the substrate thickness is between 1.6 mm and 2.0 mm, the frame hardness is between 38 and 70 degrees, and the frame thickness is not less than 6 mm. Through the arrangement of the frame and the thermally conductive adhesive, a heat conduction path is formed between the circuit board and the functional components, enabling efficient conduction and dissipation of heat generated by the circuit board or functional components, ensuring the operational reliability of the circuit board and functional components.
Owner:SHENZHEN POWEROAK NEWENER CO LTD

Cold-conducting radio-frequency therapeutic apparatus and cold-conducting radio-frequency therapeutic equipment

PendingCN121846537AImprove thermal management performancelow costElectrotherapyTherapeutic coolingRadio frequency energyHeat management
The invention relates to a cold-conducting radio-frequency therapeutic apparatus and equipment. The therapeutic side of the therapeutic apparatus is fixedly provided with two polar plates which are electrically connected with a radio-frequency circuit and drive skin to heat in the radio-frequency therapeutic process; the aluminum nitride ceramic chip is used for cooling the skin, the aluminum nitride ceramic chip is located between the two polar plates, gaps are reserved between the aluminum nitride ceramic chip and the two polar plates, and the working surface of the aluminum nitride ceramic chip and the working surfaces of the polar plates are located on the same plane and jointly form a treatment surface making contact with the skin. Due to the fact that the aluminum nitride ceramic chip is arranged, a unique cooling mode is provided, and the heat management effect of the therapeutic apparatus is remarkably improved. During or after radio frequency energy emission, the heat of skin between the electrodes is directly taken away by using the aluminum nitride ceramic chip, the cooling depth and efficiency far better than those of traditional air cooling or cold spraying are provided, a complex cooling structure is not needed, and the cost is remarkably reduced.
Owner:SHANGHAI ZISONG MEDICAL TECHNOLOGY CO LTD

Vehicle thermal management system, vehicle thermal management method, and vehicle

PendingCN122645825AImprove thermal management performanceImprove control accuracy
The application provides a vehicle thermal management system, a vehicle thermal management method and a vehicle, and relates to the technical field of vehicles.The vehicle thermal management system comprises a refrigerant circuit and a coolant circuit; the refrigerant circuit is provided with a compressor; the refrigerant circuit comprises an intelligent driving heat exchange branch, and the intelligent driving heat exchange branch is provided with a first heat exchanger; the coolant circuit comprises an intelligent driving cooling branch; the intelligent driving cooling branch is provided with an intelligent driving controller; wherein the refrigerant circuit and the coolant circuit are coupled through the first heat exchanger to perform heat exchange. The application couples refrigerant phase change heat exchange and coolant circulation, transmits the heat of the coolant to the refrigerant circuit through the heat exchanger, performs heat management on the intelligent driving controller, and improves the heat management performance of the intelligent driving controller.
Owner:GAC AION NEW ENERGY AUTOMOBILE CO LTD

External liquid cooling heat dissipation type three-joint module

The application discloses an external liquid cooling heat dissipation type three-joint module, relates to the technical field of robot joint modules, and comprises joint one, joint two and joint three and is of an integrated structure; a driver board assembly; a liquid cooling pipeline system, comprising joint one liquid cooling pipe groups distributed outside the joints, joint two liquid cooling pipe groups, joint three liquid cooling pipe groups and a driver board liquid cooling pipe distributed inside the joints, all or part of the pipelines of the joint one liquid cooling pipe groups, the joint two liquid cooling pipe groups and the joint three liquid cooling pipe groups are arranged in close contact with the shells of the joint one, the joint two and the joint three in correspondence, the driver board liquid cooling pipe is arranged beside a heat source of the driver board assembly, the joint one liquid cooling pipe groups, the joint two liquid cooling pipe groups and the joint three liquid cooling pipe groups are connected through a linking structure with a rotation allowance, and the linking structure is a detachable structure. The application solves the problems of insufficient heat dissipation, inconvenience in dismounting and replacement and poor thermal balance of multiple joints of the existing four-legged robot joint module under long-term high load.
Owner:HANGZHOU VOLT ROBOT TECHNOLOGY CO LTD

Silicon-based cellulose composite aerogel material for passive thermal management and preparation method and application thereof

The application discloses a kind of silicon-based cellulose composite aerogel materials for passive thermal management and preparation method and application thereof, belong to radiation cooling and passive thermal management technical field.The silicon-based aerogel material includes cellulose nanofiber skeleton and silica network in situ crosslinked on the cellulose nanofiber skeleton, material inside has directional arrangement vertical honeycomb pore structure;In preferred embodiment, the aerogel material also includes silica nanosphere distributed in composite network.The application improves the structural stability and heat insulation performance of silicon-based aerogel material by the synergistic effect of cellulose nanofiber skeleton, silica network and directional pore structure, and gives it higher solar reflectance and infrared radiation heat dissipation capacity, and can be used in building envelope, cold chain packaging, outdoor equipment and passive thermal management and other fields.
Owner:SOUTHEAST UNIV

High-thermal-conductivity silicon carbide single crystal substrate as well as preparation method and application thereof

According to the high-thermal-conductivity silicon carbide single crystal substrate and the preparation method and application thereof provided by the invention, impurity introduction and defect formation are effectively inhibited by optimizing raw material purity, improving thermal field design and regulating and controlling growth kinetic parameters and a post-treatment process, and thermal conductivity close to a theoretical limit is realized. Meanwhile, the invention further provides a controllable preparation method of the high-thermal-conductivity SiC substrate and application of the high-thermal-conductivity SiC substrate in advanced electronic packaging, the substrate serves as a key heat dissipation and bearing material in high-power-density electronic packaging by means of the ultrahigh thermal conductivity of the substrate and the low thermal expansion coefficient matched with a semiconductor chip, and the high-power-density SiC substrate can be applied to high-power-density electronic packaging. The method is suitable for manufacturing an intermediate layer, a thermal diffusion layer, a chip bearing substrate or a packaging integrated substrate and the like, and can effectively solve the problems of heat dissipation and reliability of high-power-density chips (such as high-performance computing chips and power modules).
Owner:JIANGSU CHAOXINXING SEMICON CO LTD

Method and device for determining running state of vehicle

PendingCN121997522AImplement discretized simulationImprove thermal management performanceElectric devicesDesign optimisation/simulationThermodynamicsHeat management
The invention discloses a vehicle running state determination method and device applied to the technical field of vehicle control, and the method comprises the steps: obtaining a sensor value collected by a sensor of a vehicle power system, and configuring a simulation model of the vehicle power system through the sensor value. The simulation model comprises a first temperature calculation unit and a second temperature calculation unit which are constructed based on a sensor. In this way, discretization simulation of the vehicle power system is achieved, data collected by multiple types of sensors are fully utilized, and the internal temperature of the vehicle power system is accurately determined. And according to the historical operation state of the vehicle power system, determining an operation unit participating in simulation. And operating the simulation model to obtain an operation result including the temperature. And determining the current running state of the vehicle power system according to the running result. In this way, the current operation state of the vehicle power system can be accurately determined, heat management can be conducted on the vehicle power system according to the current operation state, and the heat management effect is improved.
Owner:SAIC MOTOR

Package structure

PendingCN121772781AGuaranteed uptimeImprove thermal management performanceEffective solutionRedistribution layer
The invention discloses a packaging structure. The packaging structure comprises at least one rewiring layer; the conductive plug layer is electrically connected with the rewiring layer; the metal groove is located in the conductive plug layer, or the metal groove is formed by enclosing the conductive plug layer and one of the rewiring layers; the preprocessing chip is positioned in the metal groove; and at least one main chip which is in bonding connection with the preprocessing chip and the rewiring layer. The preprocessing chip is embedded into the metal groove, so that the packaging size can be obviously reduced. The heat generated by the preprocessing chip is directly conducted and dissipated by utilizing the heat conduction characteristic of the metal material, the heat dissipation bottleneck caused by traditional plastic package layer coating is broken through, the heat dissipation structure is suitable for chip integration scenes such as power devices with strict heat dissipation requirements, the heat management capability of the power devices is remarkably improved, stable and reliable operation of the preprocessing chip in a limited space is ensured, and the service life of the preprocessing chip is prolonged. And an effective solution considering both size optimization and thermal performance guarantee is provided for high-performance and high-integration-level system design.
Owner:NANTONG FUJITSU MICROELECTRONICS

Aluminum substrate power device package

PendingCN122003152Aimprove performanceImprove thermal management performanceWaferAluminum substrate
An aluminum substrate power device package comprises a power transistor wafer, an aluminum drain electrode bonding pad is arranged on the bottom face of the power transistor wafer, and a source electrode bonding pad and a switch control electrode bonding pad are arranged on the top face of the power transistor wafer. The power transistor further comprises an L-shaped aluminum substrate, the thickness of one side of the L-shaped aluminum substrate is small, and the power transistor wafer is welded to the top face of the side, with the small thickness, of the L-shaped aluminum substrate through an aluminum drain electrode bonding pad. The insulating rubber material is filled around the power transistor wafer horizontally. The L-shaped aluminum substrate is simultaneously used as a drain electrode conductive pole piece of the power transistor wafer, a packaged drain electrode bonding pad, a packaged cooling fin and a packaged substrate; through the aluminum-aluminum welding process, the wafer is welded on the L-shaped aluminum substrate, so that the processing links are reduced, the cost is saved, the performance of a power device is improved, and high-power transistor packaging with high cost performance is realized.
Owner:MOTO TECH (SHENZHEN) CO LTD

Battery monomer, battery device, energy storage device and power utilization device

PendingCN121994375AImprove thermal management performanceThermometer detailsSecondary cells manufactureHeat managementElectrical battery
The invention provides a battery monomer, a battery device, an energy storage device and a power utilization device, the battery monomer comprises a shell, a temperature detection assembly and at least one electrode assembly, the shell comprises a plurality of shell walls defining a containing cavity, and the plurality of shell walls comprise a first shell wall; the electrode assembly is arranged in the accommodating cavity; the temperature detection assembly comprises at least one temperature detection main body and an external end electrically connected with the at least one temperature detection main body, the temperature detection main body is arranged in the accommodating cavity, and the external end penetrates through the first shell wall and is exposed from one side, back to the accommodating cavity, of the first shell wall; the temperature detection main body comprises an induction part, a flexible base material, a transmission wire and an insulation protection structure, the induction part is electrically connected with the external end socket through the transmission wire, the induction part and the transmission wire are both connected to the flexible base material, and the insulation protection structure coats the outer sides of the flexible base material, the transmission wire and the induction part. The battery monomer, the battery device, the energy storage device and the power utilization device provided by the invention are beneficial to improving the thermal management effect.
Owner:CONTEMPORARY AMPEREX TECHNOLOGY CO LTD

A battery pack integrated with phase liquid cooling and a manufacturing process thereof

PendingCN122599590AImprove thermal stabilityspeed up export
The application relates to the field of battery packs, in particular to a phase liquid cooling integrated battery pack and a manufacturing process thereof. The phase liquid cooling integrated battery pack comprises a composite filling body, a shell, a liquid cooling system and a plurality of battery cabins for mounting single batteries. The plurality of battery cabins are evenly mounted in the shell, gaps are arranged between adjacent battery cabins and between the battery cabin and the shell, the composite filling body is filled in the gaps, and the liquid cooling system is mounted at the bottom of the shell. The composite filling body comprises a mixed and uniform composite phase change material and a honeycomb aluminum. The application combines solid materials, phase change materials and liquid cooling technology, significantly improves the heat dissipation efficiency and heat management capability, is particularly suitable for application scenarios with high heat dissipation and safety requirements, can meet the dual requirements of high efficiency heat dissipation and long service life of high-power and high-energy-density battery systems, and provides a more reliable solution for future electric transportation and energy storage fields.
Owner:GUANGDONG POLYTECHNIC NORMAL UNIV

Photo-thermal coupling energy storage and heat insulation synergistic outer wall structure

PendingCN122061570AIncrease the scattering absorption areaHigh photothermal conversion efficiencyPhotovoltaic supportsRoof covering using slabs/sheetsThermodynamicsMechanical engineering
The invention belongs to the technical field of energy utilization, and discloses a photo-thermal coupling energy storage and heat insulation synergistic outer wall structure which comprises a photo-thermal energy storage roof unit and a photo-thermal energy storage wall body unit. Each roof unit is formed by assembling a plurality of groups of phase-change tile bodies and is provided with an arc-shaped plate tile ridge and a circular cylindrical tile ridge structure, and the phase-change tile bodies are mounted or dismounted through locking pins and limiting hole assemblies; each wall unit is of a sliding way and latch self-locking structure and is formed by modular assembly of latch plates and tooth shell plates, and early-stage rapid installation and later-stage maintenance are facilitated. Hollow compartments are arranged in the roof units and the wall units and used for being filled with photo-thermal coupling energy storage and heat insulation synergistic flexible phase change plates, the overall design has the photo-thermal conversion function, the energy storage function and the heat insulation function, and the solar greenhouse has the advantages of being stable in structure, capable of saving energy, efficient, easy to maintain and the like and has important significance on promoting energy conservation and consumption reduction of the solar greenhouse.
Owner:BEIJING UNIV OF TECH +1