54results about How to "Uniform dimensions" patented technology

A charged particle multi-beamlet system for exposing a target using a plurality of beamlets. The system comprises a first plate having a plurality of holes formed in it, with a plurality of electrostatic projection lens systems formed at the location of each hole so that each electron beamlet passes through a corresponding projection lens system. The holes have sufficiently uniform placement and dimensions to enable focusing of the beamlets onto the surface of the target using a common control voltage. Preferably the electrostatic projection lens systems are controlled by a common electrical signal to focus the electron beamlets on the surface without correction of the focus or path of individual electron beamlets.

A plurality of container assemblies are provided. Each container assembly has substantially identical external dimensions. However, the internal volumes of certain container assemblies differ from the internal volumes of other container assemblies. The container assemblies are configured in accordance with the required volume of material to be collected or maintained in the respective container assemblies and to enable uniform head spaces despite the different volumes of materials in the respective container assemblies. Each container assembly may have an inner container and an outer container. The inner and outer containers may be assembled together or formed integrally by molding.

An array substrate for in-plane switching liquid crystal display device includes a gate line on a substrate, a data line crossing the gate line to define a pixel region, a semiconductor layer including an active area and a source area, wherein the active area overlaps the gate line and the source area overlaps the data line, a drain electrode connected to the semiconductor layer, a first capacitor electrode in the pixel region and connected to the drain electrode, a pixel electrode connected to the first capacitor electrode and substantially in parallel to the data line, a common line substantially parallel to the gate line, a second capacitor electrode connected to the common line and overlapping the first capacitor electrode, and a common electrode connected to the common line and alternatively arranged with the pixel electrode, wherein the source area of the semiconductor layer, the drain electrode, the first capacitor electrode and the pixel electrode include doped polycrystalline silicon.

One principal embodiment of the disclosure pertains to a method of optically fabricating a photomask using a direct write continuous wave laser, comprising a series of steps including: applying an organic antireflection coating over a surface of a photomask which includes a chrome-containing layer; applying a chemically-amplified DUV photoresist over the organic antireflection coating; post apply baking the DUV photoresist over a specific temperature range; exposing a surface of the DUV photoresist to the direct write continuous wave laser; and, post exposure baking the imaged DUV photoresist over a specific temperature range. The direct write continuous wave laser preferably operates at a wavelength of 244 nm or 257 nm. In an alternative embodiment, the organic antireflection coating may be applied over an inorganic antireflection coating which overlies the chrome containing layer.

The invention discloses an on-site combined type rectangular high-low frequency mixed loading connector, which comprises a connector plug and a connector socket, wherein the connector plug comprises a plug outer shell and a plurality of plug modules which can be arranged on the plug outer shell in a plurality of assembling modes to correspondingly form a plurality of types of combined type plugs and comprise a high-frequency plug module and a low-frequency plug module; the connector socket comprises a socket outer shell and a plurality of socket modules which can be arranged on the socket outer shell in a plurality of assembling modes to correspondingly form a plurality of types of combined type sockets and comprise a high-frequency socket module and a low-frequency socket module; and the structure of the combined type sockets corresponds to that of the combined type plugs. The on-site combined type rectangular high-low frequency mixed loading connector has the advantages of simple structure, convenient processing and manufacturing, standardized batch production, convenient assembly, disassembly and maintenance and stable and reliable working performance, can be used for assembling and replacing a plurality of types of the plugs and sockets randomly on site, and simultaneously realizes integrated transmission of a plurality of types of signals of high and low currents, high and low frequencies and the like.

Polytetrafluoroethylene (PTFE) flosses have abrasives added to the floss fiber that increase the abrasion to teeth surfaces, and thus result in a floss that provides enhanced cleaning of surfaces of teeth that face interstices between teeth. Floss fiber is formed by loading a PTFE resin with an abrasive filler. The PTFE resin and filler are processed to form a floss fiber with a surface that provide enhanced abrasion properties.

The invention discloses an inserted chassis diagonal-brace structure of a tower crane and belongs to the technical field of the tower crane. The diagonal-brace structure of the tower crane comprises a base section, a chassis section and a diagonal brace, wherein the bottom end of the base section is vertically and fixedly connected to a crossed beam; the bottom end of the chassis section is fixedly connected to the top surface of the base section; the diagonal brace is arranged to be inclined to the crossed beam, the bottom end of the diagonal brace is fixedly connected with the crossed beam, while the top end of the diagonal brace is fixedly connected with the chassis section, a double-lug plate with a U-shaped structure and fixedly connected with the diagonal brace is arranged at the top end of the diagonal brace, and the inner width dimension of the U-shaped structure of the double-lug plate is matched with the width dimension of a main chord; the top end of the diagonal brace is sleeved on the main chord of the chassis section through the double-lug plate, and the top end of the double-lug plate is fixedly connected with the main chord of the chassis section through a connecting piece. The chassis section is reduced in overall structure dimension and strong in transportation convenience, and simultaneously, the stress condition at the connection part is improved and the weld joint quality requirement is effectively reduced. The diagonal-brace structure of the tower crane is simple and is easy to manufacture and low in manufacturing cost.

A striker pin in a thermal switch configured as a mechanical link between a bimetallic disk and an armature spring is provided. The striker pin includes a pin of molded ceramic material. The pin has a generally cylindrical shape, a first axial end, and a second axial end. The first axial end is fastenable in fixed relation to an armature spring. A metalizing film is fused to the second axial end. A metallic deposit is fused to the metalizing film such that the metallic deposit substantially covers the second axial end.

Novel interconnect structures possessing a OSG or polymeric-based (90 nm and beyond BEOL technologies) in which advanced plasma processing is utilized to reduce post lithographic CD non-uniformity (“line edge roughness”) in semiconductor devices. The novel interconnect structure has enhanced liner and seed conformality and is therefore capable of delivering improved device performance, functionality and reliability.

A nozzle plate is manufactured by providing a material plate and a punch. The material plate is punched by the punch to form a provisional nozzle orifice hole on the material plate. The punching is repeated such that the provisional holes formed by a given punch are arranged in line. A bulged portion which is bulged on a back side of the material plate is removed to form the completed nozzle orifice.

In the present invention, the position of a substrate on a thermal plate is detected when baking after exposure is performed in a first round of patterning. In a second round of patterning, the setting position of the substrate is adjusted based on a detection result of the position before the substrate is mounted on the thermal plate in the baking after exposure. In the baking after exposure in the second round of patterning, the substrate is mounted at the same position with respect to the thermal plate as that in the baking after exposure in the first round of patterning. In performing a plurality of rounds of patterning on a film to be processed, a pattern with a desired dimension is finally formed above the substrate, and the uniformity of the pattern dimension within the substrate is ensured.

The invention discloses a torque protection device of an electric guide plate. The torque protection device comprises a rotating sleeve, an inner backing plate, an outer backing plate, a pressing plate, a bull gear, friction plates and spring parts. The rotating sleeve is connected with a transmission shaft, and is used for transmission; the inner backing plate and the pressing plate are connected to the rotating sleeve, and rotate with the rotating sleeve; the outer backing plate is connected to the bull gear, and rotates with the bull gear; the friction plates are arranged among all the fitting surfaces of the rotating sleeve, the inner backing plate, the outer backing plate, the pressing plate and the bull gear, so that torque transmission is performed among the fitting surfaces by frictional force. The spring pats are used for pressing the bull gear, the inner backing plate, the pressing plate, and the outer backing plate against the rotating sleeve firmly, and the spring parts are locked on the rotating sleeve. When the torque protection device of the electric guide plate is subjected to external impact force, and the impact force exceeds a friction torque threshold of the friction plates, the fitting surfaces will slide relatively to release the impact force. An internal friction fitting position is employed to release overloaded impact force, so that a problem of conventional electric guide is solved, wherein the problem is that parts are damaged because of hard transmission performed directly through a gear mechanism.

The invention discloses a 2.5 D forming process method of glass panels or rear glass cover plates, which comprises a clamping and positioning step, a horizontal-axis grinding step and a main-axis forming step, wherein the horizontal-axis grinding step comprises a rough grinding step and an accurate grinding step; the clamping and positioning step, the rough grinding step, the main-axis forming step and the accurate grinding step are sequentially executed through a Z-axis accurate-rough grinding device; and unprocessed glass panels or rear glass cover plates sequentially pass through the clamping and positioning step, the rough grinding step, the main-axis forming step and the accurate grinding step and then respectively form formed glass panels or rear glass cover plates. According to the 2.5 D forming process method of glass panels or rear glass cover plates, the glass panels or rear glass cover plates are clamped and positioned for only one time, the processing quality and the processing efficiency of the formed glass panels or rear glass cover plates can be simultaneously ensured, the processing cost is also reduced, and the using demands of users are met.

The invention belongs to the technical field of detection, and particularly relates to a method for detecting the boundary dimension of a curved plate. The comprises a step 1 of preparing a detectiontool and a curved plate to be detected; a step 2 of sleeving the curved surface of the curved plate with the detection tool; a step 3 of pressing down the detection tool to make the fitting surface ofthe detection tool abutted against the outline of the curved plate; a step 4 of moving a measuring block in a through groove and observing whether a prompting device sends a prompt signal, wherein ifthe boundary dimension of the curved plate is uniform and qualified, the prompting device sends the prompt signal and a marking block marks the curved plate with an mark, or if the boundary dimensionof the curved plate is not uniform, the prompting device does not sends the prompt signal. The method solves inaccurate detection of the boundary dimension of the curved plate in the prior art.

The present invention discloses process and reactor for preparing fibrous light calcium carbonate. The preparation process includes the following steps: heat the mixture of 1-5 % water slurry of Ca(OH)2 and MgCl26H2O in 2-4 times weight of Ca(OH)2 to 80-95 deg.C, carbonizing reaction of the slurry in a horizontal strip reactor and the introduced CO2 gas through one gas distributing member to carbonize the Ca(OH)2 in the slurry into fibrous calcium carbonate, and filtering and washing the effluent to obtain the fibrous light calcium carbonate. The said process has identical retaining time of Ca(OH)2 slurry inside the reactor and is favorable to the growth of fibrous light calcium carbonate to obtain fibrous light calcium carbonate in homogeneous size distribution.

The invention relates to a battery module, comprising multiple battery monomers and multiple heat conducting partition plates. The heat conducting partition plates and the battery monomers are mutually superposed in arrangement, the heat conducting partition plates are provided with a partition plate main body and multiple side plates connected with the partition plate main body, the partition plate main body and the multiple side plates form a containing space of the battery monomers together, and the edges of the side plates, which are far away from the partition plate main body, are bent and stretched to form heat dissipation fins.

The invention relates to a flexible tray for automated mounting of bulk components, and belongs to the field of automated assembling, solving the problem that in the prior art, bulk materials and short strips are not applicable to the material filling mode and the automatic feeding mode of an SMT (Surface Mount Technology) feeder and bulk materials rely on manual mounting. The provided flexible tray for automated mounting of bulk components includes a substrate and a plurality of material filling assemblies, wherein a plurality of positioning grooves are formed in the substrate; the material filling assemblies are arranged in the positioning grooves; and bulk components are filled into the material filling grooves of the material filling assemblies, and the tray is arranged on a chip mounter through the substrate, and the chip mounter is set and controlled through programs, and the bulk components in the material filling grooves are automatically positioned and picked up, and then automated mounting is completed. The flexible tray for automated mounting of bulk components realize SMT automatic mounting and multi-model sharing of multi-variety and small-volume of printed board assembly products, saves economic costs and time costs, and can effectively improve production efficiency and production quality.

The invention relates to the category of the manufacture, processing, storage or classification of ice through immersing a chilling chamber or a chilling plate in water, on F25C1/08 of international patent classification (IPC), and particularly belongs to a shell ice maker evaporator. In a technical scheme adopted by the invention, the shell ice maker evaporator comprises an ice making barrel (1) internally provided with a water scattering box (8), a water inlet (9), an ice outlet (10), an ice making pipe (5), a refrigerant inlet (6) and a refrigerant outlet (7), and the shell ice maker evaporator is characterized in that the ice making pipe (5) is externally provided with a plurality of layers of ice making layers (3) and thermal insulation pads (2) are arranged among the ice making layers (3). The shell ice maker evaporator provided by the invention has the advantages that because the ice making layer is segmented into a plurality of segments which are mutually isolated by the thermal insulation pads, the overall dimension of the produced shell ice is neat and uniform without the cutting of ice swords. By using the shell ice maker evaporator, work efficiency can be improved and the quality of the produced shell ice can also be increased.

The invention relates to a spherical core-shell type LaNiAl-SiO2 compound hydrogen storage material applicable to hydrogen separation and a preparation method thereof, and belongs to the field of hydrogen storage materials. LaNiAl alloy has a composition general formula of LaNi5-xAlx, wherein x is more than or equal to zero and less than or equal to 2; the spherical material has an outer diameter of 4-6mm, an intermediate main ingredient of LaNiAl alloy, a porous SiO2 appearance and a thickness of 1-2mm. The preparation process of a material comprises the steps of melting and powdering alloy; stirring, mixing and granulating the alloy powder with silica sol; coating with gaseous SiO2; and performing aging and hydrothermal removing treatment. The preparation method of the compound hydrogen storage material has high automatic degree, uniform appearance and size and small airflow resistance, has maximal filling capacity in a reactor, cannot be ground or further pulverized, and cannot block a filter or cause self-compaction, so that toxicity of CO, O2, NH3, H2S and other impure gases for LaNiAl alloy can be greatly reduced, and the service life is greatly prolonged. The spherical core-shell type LaNiAl-SiO2 compound hydrogen storage material can be used in a hydrogen separating process.

A pattern forming method including: a process of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin including a Repeating Unit (a1) having a group capable of being decomposed by acid and generating a carboxyl group, and a compound capable of generating acid through irradiation of actinic rays or radiation; a process of exposing the film; and a process of developing the exposed film using a developer including an organic solvent to form a negative tone pattern, wherein the value X obtained by substituting the number of each atom included in the Repeating Unit (a1) after being decomposed by acid and generating a carboxyl group in the following formula is 0<X≦5.

X=(total number of atoms configuring repeating unit after being decomposed by acid)/[(number of carbon atoms)−(number of atoms that are neither carbon atoms nor hydrogen atoms)]

A semiconductor structure and a formation method thereof are provided. The formation method includes: providing a base, the base including a pattern dense region and a pattern isolated region; forming a plurality of separate hard mask layers on the base, where adjacent hard mask layers and the base define an opening, and an opening of the pattern isolated region is wider than an opening of the pattern dense region; forming a trimming layer at least on a side wall of the opening of the pattern isolated region, the trimming layer and the hard mask layer constituting a mask structure layer; and etching, using the mask structure layer as a mask, a portion of the thickness of the base exposed by the opening to form a plurality of target pattern layers protruding from the remaining base. Embodiments and implementations of the present disclosure are advantageous for improving a critical dimension uniformity of a target pattern layer in each region.

A method of reducing critical dimension is provided. A dielectric layer is formed on a substrate. Then, a patterned photoresist is formed on the dielectric layer to expose part of the dielectric layer, wherein the patterned photoresist has a first line width. An etching process is performed to remove the exposed dielectric layer by using the patterned photoresist as an etching mask, wherein the final line width of the dielectric layer is smaller than the first line width. The conditions of the etching process include an etching pressure at 80 torr to 400 torr, an etching gas that includes a fluorocarbon compound and oxygen, wherein the ratio of the fluorocarbon compound to the oxygen is large than 0 and less than 10. Consequently, the etching process can be stabilized to form a smooth sidewall for the gate and to provide a uniform critical dimension.

An electrical connector box including a pressure contact terminal to connect to electrical wires of various diameters. A container including an upper case and lower case houses electrical wires which are gripped by slots of pressure contact terminals. Either a thick wire, which includes a core wire including multiple twisted strands, or a thin wire, which includes a single core wire, are able to connect to the uniform width slots of the pressure contact terminals.