112results about How to "Avoid physical contact" patented technology

Methods and devices arising from the practice thereof for making and using battery electrodes formed onto ion permeable, electrically non-conductive substrates, preferably battery separators are disclosed herein. Electrodes are formed onto substrates using a variety of methods including, but not limited to, spray coating and electrophoretic deposition. Electrically conductive layers may be applied to the electrode coating layer side opposite or adjacent to the substrate to act as current collectors for the battery. Multilayer devices having alternating layers of conductive layers, electrode layers and substrates, wherein the conductive layers may be in electrical communication with other conductive layers to form a battery.

A syringe for use with frontal attachments with a forwardly extending projecting structure, which recesses the nose of the syringe and keeps the recessed nose from becoming contaminated by physical contact. In one preferred embodiment, the projecting structure is tubular and internally threaded such that a standard CLAVE® connector can be attached to a pre-filled syringe at such time as the syringe is to be used. In another preferred embodiment, the projecting structure is tubular and internally threaded such that a luer lock needle attachment can be attached to a luer lock syringe at such time as the syringe is to be used.

A tire assembly with integrated electronic components includes a tire structure and an integrated electronics assembly, which preferably includes at least a radio frequency (RF) device and a multi-frequency antenna that enables wireless communication in at least first and second resonant frequency bands. Such multi-frequency antenna further comprises at least first and second antenna wires connected to the RF device, thus facilitating the transmission of RF signals which may include information such as tire identification information or measured condition information such as tire temperature, pressure, and other characteristics. The first and second antenna wires preferably function together as at least two dipole antennas, for example, two half-wave dipole antennas, or one half-wave dipole antenna and one three-half-wave dipole antenna. A two-wire configuration may be more readily implemented and also designed to reduce strains concentrated at the connection point(s) between the RF device and the antenna wires.

A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a FOW (film over wire) adhesive is formed on a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided.

A multi-purpose, heat-resistant mat that comprises a single, flexible, thin body of elastomer material, which is preferably silicone, to provide thermal insulation. The solid planar body of elastomer material of the mat further includes numerous indicia providing grooves that score the bottom surface of the elastomer material for indicia aligned visual reference to permit cutting the original mat to a smaller size for custom fitting a particular pan or bowl. The mat may be cut linearly along one or more grooves to reduce the mat to a shape and size desired by the user. The mat also acts to cushion heated dishes and breakable cookware on hard surfaces so as to prevent damage to or breakage of the dishes against the hard surface while protecting the countertop surface from burning, scorching, and other physical abrasions.

The invention discloses a hot isostatic pressing forming method used for improving the part surface quality. The hot isostatic pressing forming method comprises the following steps that three-dimensional models of a wrapping sleeve and a shape control die core are designed according to the shape and size of a formed part; the stainless steel wrapping sleeve and the carbon steel shape control die core are manufactured according to the manufactured three-dimensional models; a ceramic coating is sprayed on the surface of the shape control die core through a physical vapor deposition (PVD) method; the shape control die core is fixed in the wrapping sleeve, and the wrapping sleeve is filled with powder and shaken to be compacted; the wrapping sleeve is subjected to air exhausting and heating treatment, sealing welding is conducted when the vacuum degree in the wrapping sleeve reaches a certain degree; the wrapping sleeve is subjected to hot isostatic pressing treatment through a technique that the temperature is increased at first and then the pressure is increased so as to make the powder be tightened and compacted under the action of the high temperature and the high pressure; and the wrapping sleeve and the shape control die core are removed to obtain the final part. According to the hot isostatic pressing forming method, the carbon steel die core with the coating serves as the shape control die core, and element diffusion between carbon steel cores and the powder can be effectively prevented; element segregation of the alloy surface due to diffusion is avoided, and the alloy surface quality is improved.

A power supply system and method for a vehicle movable within a structure is provided. The power supply system includes at least one energy source arranged at a fixed location within the structure to transmit energy within the structure, and a receiver, arranged on the vehicle to receive the energy transmitted from the energy source, being configured to convert the energy to electrical power and/or thrust.

Embodiments of the present disclosure describe semiconductor device packaging techniques and devices that incorporate a heat spreader into the insulating material of a packaged semiconductor device. In one embodiment, a device comprising a semiconductor device is coupled to a substrate, and insulating material covers (i) a portion of the semiconductor device and (ii) a portion of the substrate. The device also comprises a heat spreader embedded in the insulating material and the heat spreader is isolated from the substrate at least in part by the insulating material.

An animal scent composition contains animal generated scents and a visual indicator to allow visualization of scent travel and application. The scent may be used for repelling wild and domestic animals, for attracting game animals, and for masking the scent of humans. Dispersing means provide a pressurized aerosol canister with a dispersing nozzle axially aligned with the aerosol canister to prevent clogging of the nozzle by agglomerated visual indicator particles when the scent composition is dispersed.

A battery separator is a microporous membrane. The membrane has a major volume of a thermoplastic polymer and a minor volume of an inert particulate filler. The filler is dispersed throughout the polymer. The membrane exhibits a maximum Z-direction compression of 95% of the original membrane thickness. Alternatively, the battery separator is a microporous membrane having a TMA compression curve with a first substantially horizontal slope between ambient temperature and 125° C., a second substantially horizontal slope at greater than 225° C. The curve of the first slope has a lower % compression than the curve of the second slope. The curve of the second slope is not less than 5% compression. The TMA compression curve is graphed so that the Y-axis represents % compression from original thickness and the X-axis represents temperature.

A wafer test method is performed for a wafer prior to forming bumps on the wafer, using a conductive interposer having one side with test pads and the other side with test bumps electrically connected to the test pads. The conductive interposer is mounted on the wafer having a plurality of chips, wherein the test bumps are in electrical contact with bond pads on active surfaces of the chips. Test probes are used to contact the test pads to perform tests for the chips. This wafer test method is beneficially performed prior to forming bumps on the wafer, such that the prior-art drawback of damaging bumps on the wafer by contacting test probes with the bumps on the wafer can be eliminated, and the conductive interposer mounted on the wafer prevents the test probes from physical contact with the bond pads on the chips, thereby not damaging the bond pads.

A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a dielectric layer and a FOW adhesive (film over wire) adhesive are attached onto a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided.