Dual-mode dielectric filter

Abstract

The invention relates to electronic parts and components in communication field, and particularly relates to a dual-mode dielectric filter. The filter comprises a cavity and a cover plate, wherein, inevery two adjacent inner cavities, one inner cavity is internally provided with a metal resonator capable of generating a resonant frequency, and the other inner cavity is internally provided with adielectric resonator capable of generating two resonant frequencies; a first coupling line is arranged between the metal resonator and the dielectric resonator, and a second coupling line is arrangedbetween every two adjacent dielectric resonators. The two degenerate mode resonant frequencies are generated through the dielectric resonators, and the functions of the two cavities can be achieved inthe filter, so that the dimensions can be obviously reduced under same indexes; the two degenerate mode resonant frequencies are independently controlled by the lengths of every two adjacent sides ofa dielectric block, the coupling quantity between two degenerate modes is controlled by the chamfer length of the dielectric block, and the electric parameters of the filter can be accurately controlled by controlling the boundary dimensions of the dielectric block, so that the batch uniformity is guaranteed, and the debugging time is reduced.

Description

technical field [0001] The invention relates to electronic components in the communication field, in particular to a double-mode dielectric filter. Background technique [0002] In recent years, with the increasing demand for high performance and miniaturization of communication equipment, dual-mode dielectric filters have received more and more attention. However, the previous dual-mode dielectric filters mostly used cylindrical resonators, and drilled through holes on the resonators for debugging. The disadvantage of this solution is that holes need to be drilled on the dielectric material. As we all know, ceramic materials have high hardness and no ductility. Therefore, it is impossible to precisely process through holes on the surface of ceramics by cutting like metal. At present, it is necessary to realize through holes. Holes can only be drilled on the green body before the ceramic is sintered, and then wound. However, during the sintering process, the position accura...

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Problems solved by technology

The disadvantage of this solution is that holes need to be drilled on the dielectric material. As we all know, ceramic materials have high hardness and no ductility. Therefore, it is impossible to precisely process through holes on the surface of ceramics by cutting like metal. At present, it is necessary to realize through holes. Holes can only be drilled on the green body before the ceramic is sintered, and then wound. However, during the sintering process, due to the shrinkage of the ceramic, the position accuracy and diameter accuracy of the final through hole cannot be guaranteed.

Thus affecting the consistency of mass production

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