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Orthogonality Compensation Method for Reticle and Wafer Defect Detection

A technology of orthogonal compensation and the object under test, which is applied in the field of orthogonal compensation, can solve the problems of installation deviation, non-orthogonal graphics, false detection or false detection, etc., and achieve the effect of position positioning

Active Publication Date: 2021-01-19
江苏维普光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even if the orthogonality of the high-precision positioning platform is very good, due to the installation deviation of the vacuum chuck device carrying the reticle and the wafer, and the angular deviation when placing the reticle and wafer, it will cause the positioning platform to lose its shape when scanning. It is not orthogonal, which will eventually lead to excessive deviation and false detection or false defect

Method used

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  • Orthogonality Compensation Method for Reticle and Wafer Defect Detection
  • Orthogonality Compensation Method for Reticle and Wafer Defect Detection
  • Orthogonality Compensation Method for Reticle and Wafer Defect Detection

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Embodiment

[0049] Such as figure 1 As shown, this embodiment provides a quadrature compensation system suitable for reticles and wafers.

[0050] The orthogonal compensation system includes: a main control computer, a real-time focusing module, a positioning platform for placing an object to be measured, the positioning platform is controlled by a platform controller, and an image acquisition device arranged above the positioning platform, a synchronization module connected to the platform controller,

[0051] The main control computer is suitable for controlling the positioning platform (including the setting of the positioning platform motion track, the setting of the motion speed and acceleration), and is also used for controlling the image acquisition device to perform image acquisition. The image acquisition device includes: an area array or a line array camera (may be referred to as a camera for short, and a camera is used as an example hereinafter), and a microscope or a tube len...

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Abstract

The invention relates to an orthogonal compensation method for defect detection of a mask and a wafer. The orthogonal compensation method comprises steps as follows: a horizontal deviation angle and avertical deviation angle of a to-be-detected object relative to a positioning platform are acquired by an image acquisition device, and the positioning platform is subjected to real-time position compensation according to the horizontal deviation angle and the vertical deviation angle in the scanning process of the to-be-detected object. By means of the method, accurate positioning of layers in the etching process can be effectively realized and a graph in an accurate position is acquired in the mask and wafer detection process. Finally, the accuracy can reach the absolute motion accuracy ofthe positioning platform.

Description

technical field [0001] The invention belongs to the technical field of semiconductor defect detection / photolithography, and relates to an orthogonal compensation method in semiconductor defect detection / photolithography. Background technique [0002] In the process of semiconductor lithography, the pattern on the upper layer of the template and the wafer needs to be accurately written on the other layer. During the semiconductor inspection process, it is necessary to collect images of the reticle and wafer, compare them with the design template (such as GDS), and then find the defects. Even if the orthogonality of the high-precision positioning platform is very good, due to the installation deviation of the vacuum chuck device carrying the reticle and the wafer, and the angular deviation when placing the reticle and wafer, it will cause the positioning platform to lose its shape when scanning. It is not orthogonal, which will eventually lead to excessive deviation and false...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/67
CPCG03F7/70616G03F7/7065G03F7/70725H01L21/67259
Inventor 刘庄刘建明张彦鹏
Owner 江苏维普光电科技有限公司