Self-oscillating enhanced heat exchange device and method

Abstract

The invention, which belongs to the technical field of cooling of electronic equipment, relates to a self-oscillating enhanced heat exchange device and method. With oscillation of a spoiler, a staticlayer staying at the surface of a cooling device is eliminated, so that the thermal resistance of the air and the surface of the cooling device is reduced and thus the heat exchange performance of thecooling device is enhanced. The heat exchange device having a simple structure is easy to process and manufacture; no extra power is needed. With air flowing, the spoiler generates self oscillation;when the fluid boundary layer is damaged, the heat convection efficiency is improves substantially, so that the cooling performance of the air cooling device is improved. Moreover, the size and weightof the cooling device are not increased basically.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment cooling, and relates to a self-oscillating enhanced heat exchange device and method. Background technique [0002] With the development of electronic technology, the continuous improvement of requirements leads to the continuous increase of power consumption, which makes the pressure on the heat dissipation of electronic equipment also increases. Requirements for the heat dissipation system Improve the heat dissipation capacity of the system and reduce the weight and volume. Although a lot of research has been done, each improvement increases the complexity of the system and the total power consumption of the system. Therefore, heat dissipation technology has become a major obstacle to the development of electronic technology. At present, although air-cooling technology has made some progress, compared with the ever-changing electronic technology, air cooling still cannot meet the n...

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Problems solved by technology

The main problem existing in the existing air-cooling technology is that the thermal resistance between the surface of the radiator and the air is large, resulting in a large temperature difference between the surface of the radiator and the cooling air, resulting in low efficiency of the radiator, and its The reason is that there is a "stationary layer" of air on the surface of the radiator, which isolates the heat exchange between the surface of the radiator and the flowing air

Existing radiators do not have spoilers that can destroy the "stationary layer". Generally, the thickness of the "stationary layer" is reduced by increasing the flow velocity of the wind, but this will increase the volume, weight, input power and noise of the radiator. Wait

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