Infrared detector and ceramic tube shell of built-in heater thereof

Abstract

The invention provides a ceramic tube shell of a built-in heater of an infrared detector. The ceramic tube shell of the built-in heater comprises a ceramic tube shell body; and the ceramic tube shellof the built-in heater also comprises a heating device used for heating the ceramic tube shell body and melting the solder arranged between the ceramic tube shell body and a sealing cap, wherein the heating device is embedded inside the ceramic tube shell body. Compared with indirect heat transfer through external equipment in the prior art, the heating device of the ceramic tube shell provided bythe invention is embedded inside the ceramic tube shell body, and can directly heat the ceramic tube shell body; therefore, the heating time of the ceramic tube shell body is shortened, the heating efficiency of the solder is improved, the welding strength between the ceramic tube shell body and the sealing cap is increased, and the solid welding between the ceramic tube shell body and the sealing cap is realized.

Description

technical field [0001] The invention relates to the technical field of MEMS device packaging, in particular to a ceramic shell with a built-in heater. The present invention also relates to an infrared detector comprising the above-mentioned ceramic shell with a built-in heater. Background technique [0002] MEMS device packaging is referred to as Micro-Electro-Mechanical-Systems for short, also known as micro-electromechanical system device packaging. As a kind of MEMS device packaging, ceramic packaging is more and more widely used in equipment such as inertial sensors and infrared detectors because of its advantages of light weight, good airtightness, and low cost. [0003] Generally, the ceramic packaging process is mainly divided into the following steps: [0004] Step 1: Heat the ceramic package product to the hot plate in the welding furnace; [0005] Step 2: heating the ceramic shell through the heat conduction of the hot plate, and melting the solder placed betwee...

AI Technical Summary

Problems solved by technology

In order to make the surface of the hot plate evenly heated, to obtain uniform product quality, and to ensure that the solder is fully melted so that the ceramic shell is welded firmly, and the hot plate cannot have obvious deformation, this puts forward a relatively high level of flatness of the hot plate. High requirements increase the processing difficulty of the hot plate; in addition, due to the limited accommodation space of the welding furnace, the size of the hot plate is limited, so mass production cannot be realized

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