Exposure apparatus, exposure method, and method of manufacturing article

Abstract

The present invention relates to an exposure apparatus, an exposure method, and a method of manufacturing an article. The present invention provides an exposure apparatus which exposes a substrate, comprising a measurement unit configured to measure a height of the substrate at each of a plurality of measurement points, and a control unit configured to control the height of the substrate based onmeasurement results obtained by the measurement unit, and control an operation to arrange a shot region of the substrate in a first position and expose the shot region, wherein the shot region includes a plurality of partial regions, and the control unit causes the measurement unit to measure the height of the substrate by arranging the shot region in a second position different from the first position so that the number of measurement points arranged in the plurality of partial regions is larger than that when arranging the shot region in the first position.

Description

technical field [0001] The present invention relates to an exposure device, an exposure method and a method for manufacturing an article. Background technique [0002] In recent years, in a semiconductor device manufacturing process, a semiconductor device packaging method called FOWLP (Fan-Out Wafer Level Packaging) is employed. FOWLP is a method for forming wiring layers, electrode pads, etc. by using an exposure device on a substrate constituted by arranging and fixing a plurality of preprocessed and cut semiconductor chips by means of a molding material. Such substrates are also referred to as reconstituted substrates. [0003] In the exposure apparatus, in order to arrange the surface of the substrate on the imaging plane (focus plane) of the projection optical system, the height of the substrate is measured at each of a plurality of measurement points in an optical path area of ​​light from the projection optical system, and , the alignment of the substrate in the he...

AI Technical Summary

Problems solved by technology

However, a step may be formed on a target substrate to be subjected to exposure processing by an exposure device, for example, due to difficulty in achieving flattening of the molding material on the reconstituted substrate or due to removal of a part of a layer formed on the substrate.

In such a substrate, if measurement points are respectively provided in two regions having different heights from each other due to steps, it becomes difficult to accurately align the substrate in the height direction based on measurement results of a plurality of measurement points

Images