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Aluminum dihydrogen phosphate-silica powder composite high-temperature binder and preparation method thereof

A technology of aluminum dihydrogen phosphate and high-temperature binders, which is applied in the field of inorganic high-temperature binders, can solve problems such as high curing temperature and low bonding strength, and achieve good high-temperature stability, good thermal shock resistance, and short production cycle short effect

Inactive Publication Date: 2018-05-29
河南东大高温节能材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Inorganic high-temperature adhesives are often used in high-temperature environments, but inorganic high-temperature adhesives have problems such as high curing temperature and low bonding strength.

Method used

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  • Aluminum dihydrogen phosphate-silica powder composite high-temperature binder and preparation method thereof
  • Aluminum dihydrogen phosphate-silica powder composite high-temperature binder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A preparation method of aluminum dihydrogen phosphate-silicon micropowder composite high-temperature binder, the steps are as follows:

[0026] 25-28 parts by weight of ρ-Al 2 o 3 powder, 12-15 parts by weight of 0.2-0.6 mm tabular alumina, 12-15 parts by weight of 0.5-1.0 mm tabular alumina, 22-25 parts by weight of silicon micropowder, 8-11 parts by weight of aluminum dihydrogen phosphate, 8 ~11 parts by weight of magnesium oxide and 15~20 parts by weight of water are mixed in a mixer for 15~20 minutes to obtain aluminum dihydrogen phosphate-silicon micropowder composite high-temperature binder.

[0027] After the aluminum dihydrogen phosphate-silicon micropowder composite high-temperature binder prepared in this example was fired at 1300 °C to 1600 °C, the Young's modulus, flexural strength, compressive strength and shear strength of the binder were tested. As shown in the table below:

[0028] .

Embodiment 2

[0030] A preparation method of aluminum dihydrogen phosphate-silicon micropowder composite high-temperature binder, the steps are as follows:

[0031] 26-29 parts by weight of ρ-Al 2 o 3 powder, 10-13 parts by weight of 0.2-0.6 mm tabular alumina, 10-13 parts by weight of 0.5-1.0 mm tabular alumina, 21-24 parts by weight of silicon micropowder, 10-13 parts by weight of aluminum dihydrogen phosphate, 10 -13 parts by weight of magnesium oxide and 15-20 parts by weight of water are mixed in a mixer for 15-20 minutes to obtain aluminum dihydrogen phosphate-silicon micropowder composite high-temperature binder.

Embodiment 3

[0033] A preparation method of aluminum dihydrogen phosphate-silicon micropowder composite high-temperature binder, the steps are as follows:

[0034] 27-30 parts by weight of ρ-Al 2 o 3 powder, 11-14 parts by weight of 0.2-0.6 mm tabular alumina, 11-14 parts by weight of 0.5-1.0 mm tabular alumina, 20-23 parts by weight of silicon micropowder, 9-12 parts by weight of aluminum dihydrogen phosphate, 9 12 parts by weight of magnesium oxide and 15-20 parts by weight of water are mixed in a mixer for 15-20 minutes to obtain a composite high-temperature binder of aluminum dihydrogen phosphate-silicon micropowder.

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Abstract

The invention discloses an aluminum dihydrogen phosphate-silica powder composite high-temperature binder and a preparation method thereof. The preparation method comprises the following steps: uniformly mixing 25-30 parts by weight of rho-Al2O3 powder, 10-15 parts by weight of 0.2-0.6mm tabular corundum, 10-15 parts by weight of 0.5-1.0mm tabular corundum, 20-25 parts by weight of silica powder, 8-13 parts by weight of aluminum dihydrogen phosphate, 8-13 parts by weight of magnesium oxide and 15-20 parts by weight of water in a mixer, thereby obtaining the aluminum dihydrogen phosphate-silicapowder composite high-temperature binder. The aluminum dihydrogen phosphate-silica powder composite high-temperature binder overcomes the problems such as low bonding strength, limited use temperaturerange and high curing temperature of an existing high-temperature binder, and has the characteristics of being low in cost, simple in process, low in curing temperature and good in strength at a hightemperature.

Description

technical field [0001] The invention belongs to the technical field of inorganic high-temperature binders, and in particular relates to a composite high-temperature binder of aluminum dihydrogen phosphate-silicon micropowder. Background technique [0002] With the rapid development of aerospace, electronics, and machinery manufacturing industries, people have an increasing demand for high-temperature-resistant materials and higher performance requirements, and the connection of high-temperature-resistant material components is a solution to improve the overall performance of materials. an important question. The connection technology includes three connection technologies of bonding, welding and mechanical connection. Among them, high-temperature adhesives have been widely used as one of the important means to connect high-temperature material components. The use of bonding technology can increase the overall bearing load of the bonding interface of the material, greatly i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B12/02
CPCC04B12/022C04B12/027
Inventor 樊国栋邓承继丁军余超祝洪喜陈洋董博
Owner 河南东大高温节能材料有限公司
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