Half-hole board burr improvement technological process

Abstract

The invention discloses a half-hole board burr improvement technological process comprising the following steps in turn: board cutting: the raw material is cut into a board of the specified size according to the requirements; drilling: the board is drilled by using a drilling machine; conductive adhesive: a dry film is adhered on the internal layer of the board; pattern transferring: the image istransferred to the board; electroplating: line electroplating is performed on the board: gong half-hole: half-hole milling is performed on the board; etching: the copper foil of the unrequired part isremoved; AOI: appearance detection is performed on the board; soldering resisting: hole digging is performed on a green oil layer so that the solder pad is enabled to be exposed; characters: the characters are printed on the board; surface treatment; and formation. According to the half-hole board burr improvement technological process, multiple half-hole burrs caused by the PCB half-hole gong board can be effectively prevented so that the percent of pass of PCB production can be greatly enhanced and the labor of the workers can be reduced.

Description

technical field [0001] The invention relates to the technical field of PCB board production technology, in particular to a process flow for improving burrs on a half-hole board. Background technique [0002] The existing production process of PCB board is: material cutting-drilling-conductive adhesive-graphic transfer-plating-etching-AOI-solder mask-text-surface treatment-forming-gong board-test-FQC-packaging, here In the existing process flow, the gong plate operation is performed after the PCB board is formed, for example, the gong hole is made on the half hole of the half hole plate. The formation of burrs and burrs, or the lack of copper in the half hole, the gong cannot be dropped, and the copper wire remains. [0003] With the gradual increase in orders for half-hole plates, the burrs on the edges of half-hole plates seriously affect the production quality of PCB boards. It is very easy to cause the orifice to be strained, resulting in scrapping. Contents of the in...

AI Technical Summary

Problems solved by technology

[0002] The existing production process of PCB board is: material cutting-drilling-conductive adhesive-graphic transfer-plating-etching-AOI-solder mask-text-surface treatment-forming-gong board-test-FQC-packaging, here In the existing process flow, the gong plate operation is performed after the PCB board is formed, for example, the gong hole is made on the half hole of the half hole plate. The formation of burrs and burrs, or the lack of copper in the half hole, the gong cannot be dropped, and the copper wire remains, etc.

[0003] With the gradual increase in orders for half-hole plates, the burrs on the edges of half-hole plates seriously affect the production quality of PCB boards. It is very easy to cause the orifice to be strained, resulting in scrapping