Semiconductor device and semiconductor integrated system
An integrated system and semiconductor technology, applied in semiconductor devices, electric solid state devices, digital memory information, etc., can solve the problems of testing and debugging memory chips without direct access to memory chips.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0023] figure 1 is a diagram for explaining the configuration of the semiconductor device 1 according to the first embodiment.
[0024] Such as figure 1 As shown, the semiconductor device 1 is a semiconductor device in which a plurality of chips are mounted in a common package.
[0025] Specifically, the semiconductor device 1 includes a logic chip PU and a memory chip MD.
[0026] The logic chip PU is a chip such as a processor unit combined so as to realize a predetermined function.
[0027] The memory chip MD is a chip including memory elements that store data.
[0028] The logic chip PU is coupled with the memory chip MD, and transmits and receives clocks, control signals, addresses, and data to and from the memory chip MD. For example, the memory chip MD operates in synchronization with the clock from the logic chip PU. The memory chip MD is accessed according to the input of the control signal and the address from the logic chip PU. For example, data is read from t...
no. 2 example
[0078] Figure 8 is a diagram for explaining the structure of the semiconductor device 1# of the second embodiment.
[0079] Such as Figure 8 As shown, semiconductor device 1# mounts a plurality of memory chips MDA and MDB and a common logic chip PU in a common package.
[0080] Each of the memory chips MDA and MDB is configured to be accessible from the logic chip PU.
[0081] other parts and figure 1 The components are the same, so their detailed description will not be repeated.
[0082] The memory chip MDA includes a test circuit TCA and a serial bus interface circuit SIFA.
[0083] The memory chip MDB includes a test circuit TCB and a serial bus interface circuit SIFB.
[0084] Test circuits TCA and TCB are basically the same as test circuit TC.
[0085] The serial bus interface circuits SIFA and SIFB are basically the same as the serial bus interface circuit SIF.
[0086] An external terminal SDAP and an external terminal SCLP are provided as common terminals of ...
no. 3 example
[0094] Figure 9 is a diagram for explaining the configuration of the system board SD# based on the third embodiment.
[0095] Such as Figure 9 As shown, on a system board SD# (motherboard), an overall control unit MCU that controls the entire system board SD#, a plurality of semiconductor devices 1A to 1C, and a serial bus SB are mounted.
[0096] The semiconductor device 1A mounts a plurality of memory chips MDA, MDB, MDC, and MDD and a logic chip PU in a common package.
[0097] Each of the memory chips MDA, MDB, MDC, and MDD is configured to be accessible from the logic chip PU. other parts and figure 1 The components are the same, so their detailed description will not be repeated.
[0098] In this example, a case where identification information is assigned to each of the memory chips MDA to MDD is shown. Furthermore, a case is shown in which identification information is also assigned to each of the plurality of semiconductor devices 1A to 1C.
[0099] Specifical...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


