Unlock instant, AI-driven research and patent intelligence for your innovation.

Waterproof heat-resistant protective film for electronic components

A technology for electronic components and protective films, applied in the field of waterproof and heat-resistant protective films for electronic components, can solve the problems of unsatisfactory water resistance and heat resistance, and achieve good protection, good water resistance, and improved heat resistance. Effect

Inactive Publication Date: 2018-06-08
JIANGSU SIRUIDA NEW MATERIAL TECH
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional protective film can only prevent the surface of electronic components from being worn, but its waterproof and heat resistance are not ideal. In view of this, it is necessary to improve the traditional protective film for electronic components

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Waterproof heat-resistant protective film for electronic components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A waterproof and heat-resistant protective film for electronic components, including a substrate film, an inner protective film is provided on the lower surface of the substrate film, a pressure-sensitive adhesive is coated between the substrate film and the inner protective film, and the lower surface of the inner protective film is coated with Covered with a waterproof adhesive layer, the lower surface of the waterproof adhesive layer is coated with heat-resistant glue and glue in turn, and the lower surface of the glue is covered with a release layer. The heat-resistant glue includes the following components by weight: polyvinyl alcohol 22 parts, 18 parts of nonyl phenolic resin, 16 parts of acrylic resin, 15 parts of succinic anhydride, 15 parts of nano-scale silica powder, 12 parts of sodium silicate, 8 parts of polyimide, methyltrialkoxysilane 17 parts, 13 parts of acetone, 8 parts of triethylamine, 9 parts of sodium hexametaphosphate, 3 parts of silicone defoamer ...

Embodiment 2

[0021] A waterproof and heat-resistant protective film for electronic components, including a substrate film, an inner protective film is provided on the lower surface of the substrate film, a pressure-sensitive adhesive is coated between the substrate film and the inner protective film, and the lower surface of the inner protective film is coated with Covered with a waterproof adhesive layer, the lower surface of the waterproof adhesive layer is coated with heat-resistant glue and glue in turn, and the lower surface of the glue is covered with a release layer. The heat-resistant glue includes the following components by weight: polyvinyl alcohol 35 parts, 29 parts of nonyl phenolic resin, 24 parts of acrylic resin, 21 parts of succinic anhydride, 18 parts of nano-scale silica powder, 16 parts of sodium silicate, 13 parts of polyimide, methyltrialkoxysilane 25 parts, 17 parts of acetone, 14 parts of triethylamine, 12 parts of sodium hexametaphosphate, 8 parts of silicone defoam...

Embodiment 3

[0025] A waterproof and heat-resistant protective film for electronic components, including a substrate film, an inner protective film is provided on the lower surface of the substrate film, a pressure-sensitive adhesive is coated between the substrate film and the inner protective film, and the lower surface of the inner protective film is coated with Covered with a waterproof adhesive layer, the lower surface of the waterproof adhesive layer is coated with heat-resistant glue and glue in turn, and the lower surface of the glue is covered with a release layer. The heat-resistant glue includes the following components by weight: polyvinyl alcohol 27 parts, 22 parts of nonyl phenolic resin, 20 parts of acrylic resin, 18 parts of succinic anhydride, 17 parts of nano-scale silica powder, 14 parts of sodium silicate, 11 parts of polyimide, methyltrialkoxysilane 21 parts, 15 parts of acetone, 12 parts of triethylamine, 11 parts of sodium hexametaphosphate, 6 parts of silicone defoam...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a waterproof heat-resistant protective film for electronic components. The film comprises a substrate film, the lower surface of the substrate film is provided with an inner protective film, the lower surface of the inner protective film is coated with a waterproof adhesive layer, and the lower surface of the waterproof adhesive layer is in turn coated with a heat-resistantglue and an adhesive, and the lower surface of the adhesive is covered with a release layer. The waterproof heat-resistant protective film for electronic components of the present invention has goodwater resistance, adhesiveness and heat resistance, and the heat resistance of the protective film can be well improved by adding a heat-resistant glue layer to the protective film, thus better protection is provided for the electronic components, and damage to the electronic components caused by heat generated by long-time use is prevented.

Description

technical field [0001] The invention relates to the technical field of protective film production, in particular to a waterproof and heat-resistant protective film for electronic components. Background technique [0002] Protective film can be divided into digital product protective film, car protective film, household protective film, food fresh-keeping protective film and so on according to the application. Digital product protective film is widely used in the production process of FPC, PCB and electronic components to protect the surface material and prevent the occurrence of static electricity. Traditional protective films can only prevent the surface of electronic components from being worn, but their water resistance and heat resistance are not ideal. In view of this, it is necessary to improve traditional protective films for electronic components. Contents of the invention [0003] In order to solve the deficiencies of the prior art, the object of the present inve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29C09J7/30C09J129/04C09J4/06C09J4/02C09J11/04C09J11/06
CPCC08K2003/324C08K2201/011C08L2201/08C08L2205/035C09J4/06C09J11/04C09J11/06C09J129/04C09J2203/326C09J2301/208C09J2301/312C09J2301/408C09J2429/00C09J2433/00C09J2461/00C09J2463/00C09J2467/006C09J2479/08C09J2483/00C08L61/06C08L33/00C08L79/08C08K13/02C08K3/36C08K3/34C08K5/5419C08K3/32
Inventor 蔡磊
Owner JIANGSU SIRUIDA NEW MATERIAL TECH