Method for simultaneously sintering two surfaces of double-sided copper-clad ceramic substrate
A ceramic substrate, double-sided copper cladding technology, applied in electrical components, circuits, semiconductor/solid-state device manufacturing, etc., can solve the problems of contact traces, affecting sintering process parameters, reducing the size of the sintering pad, and achieving convenient placement and positioning, reduce the contact area, and improve the effect of production efficiency
Inactive Publication Date: 2018-06-08
SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD
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[0003] Aiming at the problems existing in the prior art, the present invention provides a method for simultaneous sintering of both sides of a double-sided copper-clad ceramic substrate, using the aluminum nitride plate as a sintering backing plate by utilizing the property that aluminum nitride will not bond with copper sheets without oxidation treatment material, to solve the problem that the sintering backing plate is easy to bond with copper or leave bad contact marks on the surface of the copper sheet; at the same time, by reducing the size of the sintering backing plate, it solves the problem that the excessive contact area between the original sintering backing plate and the copper sheet affects the sintering process parameter problem
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[0021] The present invention will be further described below in conjunction with the accompanying drawings.
[0022] The purpose of the present invention is to use the aluminum nitride plate as the sintering backing plate to realize the sintering of the double-sided copper sheet and the ceramic plate at the same time, and solve the problem that the sintering backing plate made of other materials is easy to bond with copper or leave behind on the surface of the copper sheet after sintering. The problem of poor contact traces and reducing the influence of the sintering backing plate on the sintering process parameters. Moreover, the operation is easy, and the product yield and production efficiency can be improved.
[0023] Following are the manufacturing steps of the present invention:
[0024] 1. Cut aluminum nitride small circular plate 5, with a diameter of Φ5~Φ15mm and a thickness of 0.5~1.0mm
[0025] 2. Open 4 to 6 rows of holes on the alumina ceramic plate 6 of 138×190...
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Abstract
The invention provides a method for simultaneously sintering two surfaces of a double-sided copper-clad ceramic substrate; the characteristic that aluminum nitride without oxidation treatment is not combined with a copper sheet is utilized; an aluminum nitride plate is used as a sintering base plate material so as to solve the problem that the sintering base plate is prone to being adhered together with copper or leaving contact marks on the surface of the copper sheet; meanwhile, the appearance size of the sintering base plate is reduced, so that the problem that the contact area of the original sintering base plate with the copper sheet is too large to influence sintering process parameters is solved.
Description
technical field [0001] The invention belongs to the field of semiconductor manufacturing, and relates to a preparation method of a double-sided copper-clad ceramic substrate. Background technique [0002] The DBC double-sided copper-clad ceramic substrate is sintered on both sides at the same time. The two-sided copper sheet and the ceramic plate are sintered at one time: the first copper sheet is placed on the sintering backing plate, the ceramic plate is placed on the copper sheet, and the second copper sheet is placed on the surface. The pieces are placed on a ceramic plate for sintering. The sintering backing plate is usually made of high-temperature-resistant metal materials such as Inconel and nickel-cadmium alloy into a mesh shape or made of ceramic materials such as Y2O3, MgO, and SiC in a long strip under the copper sheet, but the sintering backing plate made of these materials is used There are some problems in the process: 1. It is easy to bond with copper or lea...
Claims
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Login to View More IPC IPC(8): H01L21/324H01L21/50
CPCH01L21/3245H01L21/50
Inventor 王斌贺贤汉戴洪兴张学伍张恩荣
Owner SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD