Buried metal block pcb and manufacturing method thereof

Abstract

The invention discloses a metal block-embedded PCB and a manufacturing method thereof. The manufacturing method of the metal block-embedded PCB comprises the following steps of preparing a metal block, a prepreg, a first group plate and a second group plate, wherein each of the first group plate and the second group plate comprises at least one core plate; setting a through groove in the second group plate; enabling the first group plate, the prepreg and the second group plate to be stacked from the bottom up, and enabling the metal block to be embedded in the through groove of the second group plate to form a pre-pressing plate; putting the pre-pressing plate into a lamination apparatus to be laminated to form a pressing plate; setting multiple heat dissipation holes in the pressing plate, wherein the heat dissipation holes run through the first group plate and the prepreg between the first group plate and the second group plate, and the multiple heat dissipation holes are in butt joint with the metal block; and performing electroplating hole filling on the heat dissipation holes to obtain the metal block-embedded PCB. By virtue of the manufacturing method, high smoothness of thesurface of the PCB can be ensured, the bonding performance of the chip can be ensured, and excellent heat dissipation performance can be achieved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a buried metal block PCB and a manufacturing method thereof. Background technique [0002] With the continuous improvement of chip manufacturing process, hundreds of millions or even billions of transistors are placed in smaller and smaller chips. Big. The stability of chip operating temperature is crucial to chip performance. The packaging mode of the chip affects the heat dissipation efficiency of the chip to a certain extent. Among the many packaging methods, COB (chip on board) packaging has become the preferred packaging mode to solve the problem of chip heat dissipation because of its efficient thermal management mode. , and it also has the advantages of saving space and simple manufacturing process. The COB package is to directly stick the bare chip on the PCB (Printed Circuit Board, printed circuit board) through thermal conductive adhesive, and connect ...

AI Technical Summary

Problems solved by technology

However, limited by the industry's technological capabilities, the height difference between the metal block and the PCB surface is about 3 mils (1 mil = 25.4 microns). The flatness requirement of the block area is that the height drop is less than 10 microns, which far exceeds the existing industry production capacity

Therefore, the current technology cannot meet the requirements of chip heat dissipation and ultra-high flatness at the same time

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