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Anisotropic conductive film and display device using same

An anisotropic, conductive film technology, used in conductive adhesives, film/sheet adhesives, conductors, etc., to achieve the effects of low DSC heat change rate, good storage stability, and high particle capture rate

Active Publication Date: 2018-06-08
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, there is the challenge of achieving fast curing at low temperatures

Method used

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  • Anisotropic conductive film and display device using same
  • Anisotropic conductive film and display device using same
  • Anisotropic conductive film and display device using same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0156] Example 1: Preparation of anisotropic conductive film

[0157] By mixing 35% by weight of a biphenylene type binder resin (FX-293, Nippon Steel Corporation), 35.95% by weight of an alicyclic epoxy resin having an epoxy equivalent of 130 g / eq (hereinafter referred to as epoxy resin 1 , celloxide2021P, Daicel Corporation), 5% by weight of silsesquioxane compound (TX-100, Toagosei Co., Ltd.) containing oxetane group, 0.05% by weight of the compound of chemical formula 1-1 (SI- S, Sanshin Chemical Co., Ltd., Japan), 4% by weight of cationic curing agent (SI-B3A, Sanshin Chemical Co., Ltd., Japan) and 20% by weight of electrically conductive particles (AUL-704F, average particle diameter 4 μm, subjected to insulation treatment, Sekisui Co., Ltd., Japan) to prepare the composition for anisotropic conductive film.

[0158] [chemical formula 1-1]

[0159]

[0160] The composition for the anisotropic conductive film was coated on the release film and dried in a drying machi...

example 2

[0161] Example 2: Preparation of anisotropic conductive film

[0162] The anisotropic conductive film (Tg: 198° C.) of Example 2 was prepared in the same manner as in Example 1, but the epoxy resin, oxetane group-containing silsesquioxane compound were changed as listed in Table 1 and the amount of the compound of chemical formula 1-1.

example 3

[0164] The anisotropic conductive film (Tg: 195° C.) of Example 3 was prepared in the same manner as in Example 1, but YX4000 (hereinafter Epoxy Resin 2, Mitsukoshi Chemical, Japan) was used as the epoxy resin.

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Abstract

The present invention relates to an anisotropic conductive film and a display device comprising the same, the anisotropic conductive film being formed of a composition for an anisotropic conductive film, containing 1-14 wt% of a silsesquioxane compound containing an oxetane group on the basis of the total weight of solids, wherein the elastic modulus measured at 30 DEG C after film hardening is 2.5-4 GPa, and the rate of change in calorific value on a thermal differential scanning calorimeter (DSC) after the storage at 25 DEG C a for 5 days is 20% or lower.

Description

technical field [0001] The invention relates to an anisotropic conductive film and a display device using it. Background technique [0002] Generally, an anisotropic conductive film (ACF) refers to a film-type adhesive prepared by dispersing conductive particles in a resin such as epoxy resin, and is formed of an anisotropic adhesive polymer film, The polymer film exhibits conductive properties in the thickness direction of the film and insulating properties in the surface direction thereof. When the anisotropic conductive film placed between the circuit boards to be connected is subjected to heating / compression under certain conditions, the circuit terminals of the circuit boards are electrically connected to each other via conductive particles, and the insulating adhesive resin fills the space between adjacent electrodes To isolate the conductive particles from each other, thereby providing high insulation performance. [0003] Recently, thinner glass substrates have bee...

Claims

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Application Information

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IPC IPC(8): H01B5/16C08J5/18C08K5/5415C09J11/06C09J9/02C09J7/00C09J171/10C09J163/00
CPCC08J5/18C09J9/02C09J11/06C08K5/5415C09J163/00C09J171/10H01B5/16C09J7/10
Inventor 朴永祐高连助金智软宋基态申遇汀崔贤民许健宁黃慈英
Owner KUKDO ADVANCED MATERIALS CO LTD
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