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Anisotropic conductive film and display device using same

An anisotropic, conductive film technology, applied in the direction of conductive adhesives, film/sheet adhesives, conductors, etc., to achieve the effects of low DSC heat change rate, good storage stability, and high particle capture rate

Active Publication Date: 2020-02-18
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, there is the challenge of achieving fast curing at low temperatures

Method used

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  • Anisotropic conductive film and display device using same
  • Anisotropic conductive film and display device using same
  • Anisotropic conductive film and display device using same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0157] Example 1: Preparation of anisotropic conductive film

[0158] By mixing 35 wt% of biphenyl fluoride type binder resin (FX-293, Japan Steel Corporation), 35.95 wt% of alicyclic epoxy resin having an epoxy equivalent of 130g / eq (hereinafter referred to as epoxy resin 1 , Celloxide2021P, Daicel Corporation), 5% by weight of oxetane group-containing silsesquioxane compound (TX-100, Toagosei Co., Ltd.), 0.05% by weight of the compound of Chemical Formula 1-1 (SI- S, Sanxin Chemical Co., Ltd., Japan), 4% by weight of cationic curing agent (SI-B3A, Sanxin Chemical Co., Ltd., Japan) and 20% by weight of conductive particles subjected to insulation treatment (AUL-704F, average particle diameter of 4μm, Sekisui Co., Ltd., Japan) to prepare a composition for anisotropic conductive film.

[0159] [Chemical formula 1-1]

[0160]

[0161] The composition for the anisotropic conductive film was coated on the release film and dried in a drying machine at 60°C for 5 minutes to volatilize th...

example 2

[0162] Example 2: Preparation of anisotropic conductive film

[0163] The anisotropic conductive film of Example 2 (Tg: 198°C) was prepared in the same manner as in Example 1, except that the epoxy resin and the oxetane group-containing silsesquioxane compound were changed as listed in Table 1. And the amount of the compound of formula 1-1.

example 3

[0165] The anisotropic conductive film (Tg: 195°C) of Example 3 was prepared in the same manner as in Example 1, except that YX4000 (hereinafter epoxy resin 2, Mitsukoshi Chemical, Japan) was used as the epoxy resin.

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Abstract

The invention discloses an anisotropic conductive film and a display device comprising it. The anisotropic conductive film is formed of a composition for an anisotropic conductive film comprising 1% by weight to 14% by weight of an oxetane group-containing silsesquioxane compound based on the total weight of solids, wherein the modulus of elasticity measured at 30°C after curing of the film is 2.5GPa to 4GPa and the rate of change in heat measured by differential scanning calorimetry (DSC) after storage at 25°C for 5 days is 20% or less than 20%.

Description

Technical field [0001] The present invention relates to an anisotropic conductive film and a display device using the same. Background technique [0002] Generally speaking, anisotropic conductive film (ACF) refers to a film-type adhesive prepared by dispersing conductive particles in a resin such as epoxy resin, and is formed of an anisotropic adhesive polymer film, The polymer film exhibits conductive properties in the thickness direction of the film and insulating properties in the surface direction thereof. When the anisotropic conductive film placed between the circuit boards to be connected is heated / compressed under specific conditions, the circuit terminals of the circuit boards are electrically connected to each other via conductive particles, and the insulating adhesive resin fills the space between the adjacent electrodes To isolate conductive particles from each other, thereby providing high insulation performance. [0003] Recently, due to the reduction in the thickn...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/16C08J5/18C08K5/5415C09J11/06C09J9/02C09J7/00C09J171/10C09J163/00C09J7/10
CPCC08J5/18C09J9/02C09J11/06C08K5/5415C09J163/00C09J171/10H01B5/16C09J7/10
Inventor 朴永祐高连助金智软宋基态申遇汀崔贤民许健宁黃慈英
Owner KUKDO ADVANCED MATERIALS CO LTD
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