Underfloor heating assembly and paving method thereof

A component and floor heating technology, which is applied in the field of floor heating components and its pavement, can solve the problems of poor maintainability, difficult construction, high floor occupation, etc., and achieve the effects of large heat dissipation, convenient construction, and light weight

Active Publication Date: 2018-06-12
ZHEJIANG YASHA DECORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The floor heating paving using wet paving raises the height of the ground by 80-110mm. Therefore, there are problems such as high floor height, self-heavy, difficult construction, and poor maintainability.

Method used

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  • Underfloor heating assembly and paving method thereof
  • Underfloor heating assembly and paving method thereof
  • Underfloor heating assembly and paving method thereof

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Embodiment Construction

[0054] The specific implementation manner of the present invention will be further described below in conjunction with the accompanying drawings. Wherein the same components are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer ” refer to directions towards or away from the geometric center of a particular part, respectively.

[0055] Such as Figure 1-3 and Figure 8 As shown, the floor heating assembly provided by an embodiment of the present invention includes a plurality of insulation boards 1 for laying on the ground, a diamond-shaped connector 2 arranged on each insulation board 1 and a plurality of diamond-shaped connectors 2 connected above block panel3.

[0056] Any adjacent two insulation boards 1 are plugged together, and the upper surface of each insulation board 1 is provided w...

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PUM

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Abstract

The invention discloses an underfloor heating assembly. The underfloor heating assembly comprises a plurality of heat preservation plates laid on the ground, rhombus connection pieces arranged on theheat preservation plates and a plurality of panels connected to the upper portions of the rhombus connection pieces. Every two adjacent heat preservation plates are connected together in an inserted mode, a water pipe groove used for storing a water pipe is formed in the upper surface of each heat preservation plate, and the water pipes are stored in the water pipe grooves correspondingly. A connection groove used for storing each rhombus connection piece is formed in the upper surface of each heat preservation plate, each rhombus connection piece is correspondingly assembled in the corresponding connection groove, and every two adjacent rhombus connection pieces are connected together. The invention further discloses a paving method of the underfloor assembly. The self weight of the underfloor assembly is low, the bearing pressure of a floorslab is reduced, plate type industrialized production and rapid mounting are achieved, the construction efficiency is improved, the heat dissipation quantity is large, the temperature can be increased rapidly, and the requirement for rapid heating is met.

Description

technical field [0001] The invention relates to the technical field of decoration, in particular to a floor heating component and a paving method thereof. Background technique [0002] Low-temperature floor heating radiant heating is a heating method that uses the ground inside a building as a heat sink. The existing floor heating laying methods are all wet paving, and its structure is divided into a heat insulating layer, a filling layer and a balancing layer. The heat insulation layer is located on the floor surface, the water pipe coil is on it, and it is fixed on the heat insulation layer with plastic fasteners. The material of the filling layer is concrete, which is laid on the water pipe with on-site mixing, and the thickness is between 40-60mm; the balance layer is on the filling layer, and the thickness is about 20-30mm. The floor heating paving using wet paving raises the height of the ground by 80-110mm. Therefore, there are problems such as high occupied floor h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02F24D3/14
CPCF24D3/141E04F15/02E04F2290/023Y02B30/00
Inventor 许伟周东珊钟诚李梦珺武鹏余文钊步挺
Owner ZHEJIANG YASHA DECORATION
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