Ceramic bonding agent grinding tool

A ceramic bond, abrasive tool technology, applied in abrasives, manufacturing tools, metal processing equipment and other directions, can solve the problems of self-sharpening of abrasive tools, moderate consumption of bonding materials, etc., to reduce sintering temperature, maintain mechanical strength and Water resistance and low sintering temperature

Active Publication Date: 2018-06-15
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the sintering temperature of the vitrified bond abrasive is lowered, the bonding material is prone to moderate consumption, and self-sharpening of the abrasive is easy to occur

Method used

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  • Ceramic bonding agent grinding tool
  • Ceramic bonding agent grinding tool
  • Ceramic bonding agent grinding tool

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0035] In the present embodiment, for containing by ZnO and Zr 2 o 3 The intermediate oxide composed of ZnO, or the intermediate oxide composed of Zr 2 o 3 A vitrified bonded abrasive tool composed of an intermediate oxide is produced by changing the intermediate oxide and its compounding amount. For each intermediate oxide, two types were produced by changing the compounding amount, and a total of 6 types of vitrified bonded abrasive tools were produced. In addition, the water resistance and flexural strength of each produced vitrified bonded abrasive tool were tested.

[0036] will contain ZnO and Zr 2 o 3 The names of the vitrified bonded abrasive tools of the formed intermediate oxides are described as "Example 1-1" and "Example 1-2", respectively. The names of the vitrified bonded abrasives containing the intermediate oxide composed of ZnO are respectively referred to as "Example 2-1" and "Example 2-2". will contain the Zr 2 o 3 The names of the vitrified bonded ...

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PUM

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Abstract

The invention provides a ceramic bonding agent grinding tool which is low in sintering temperature, and is properly consumed through grinding, and the mechanical strength and the water resistance aremaintained on the other hand. The ceramic bonding agent grinding tool is provided with abrasive particles and a bonding material, the binding material comprises an oxide which serves as a main component to form a network, and an oxide which is used as an additive to modify the network, and an intermediate oxide, wherein the oxide for forming the network is made of SiO2, Al2O3 and B2O3, wherein theoxide modified by the network comprises Na2O, CaO, K2O, BaO or Li2O; the intermediate oxide is composed of ZnO and Zr2O3.

Description

technical field [0001] The present invention relates to a vitrified bonded grinding tool mounted on a grinding wheel provided in a grinding device for grinding a workpiece. Background technique [0002] Device chips are formed by grinding the back surface of a wafer on which a plurality of devices are formed, thinning the wafer to a predetermined thickness, and dividing the wafer along predetermined dividing lines. Device chips that include devices such as ICs and LSIs are used in large quantities in electronic equipment such as mobile phones and personal computers. [0003] A grinding device is used for grinding the back surface of the wafer. This grinding device includes a disc-shaped grinding wheel, a main shaft that rotatably supports the grinding wheel, a motor that rotates the main shaft, and the like. A plurality of grindstones are attached to the grinding wheel, and these grindstones come into contact with workpieces such as wafers to grind the workpieces. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/14
CPCB24D3/14B24D3/342
Inventor 星川裕俊
Owner DISCO CORP
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