A mems microstructure three-axis vibration excitation device based on base excitation method

Abstract

The invention discloses a MEMS microstructure three-axis vibration device based on a base excitation method, which includes a sleeve, piezoelectric ceramics, a pressure sensor, upper and lower connecting blocks, elastic supports and a MEMS microstructure; The end is provided with an annular top plate and a bottom plate, and the microstructure is set on the annular top plate through an elastic support; guide shafts are evenly distributed between the annular top plate and the bottom plate, and the lower connecting block is provided with a guide arm and is passed through and sleeved by the sleeve wall. On the guide shaft, there are locking devices on the guide arm respectively; on the upper and lower coupling blocks, there are respectively provided spherical grooves and protrusions that cooperate with each other; piezoelectric ceramics are sandwiched between the pressure sensor and the elastic support ; The outer edge of the upper connection block is pushed into the inner wall of the sleeve through the ball plunger. The device can apply different sizes of pre-tightening force to the piezoelectric ceramics, so that the obtained pre-tightening force measurement value is more accurate, and the adjustment process of compensating the parallelism error of the two working surfaces of the piezoelectric ceramics becomes smoother and smoother, which is convenient Test dynamic characteristic parameters.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, in particular to a MEMS microstructure three-axis vibration excitation device based on a base excitation method. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it is first nece...

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Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

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