High-frequency link technology-based isolation type modular multi-level converter

A modular multi-level, high-frequency isolation technology, applied in the direction of adjusting electrical variables, output power conversion devices, DC power input conversion to DC power output, etc., can solve voltage imbalance, low power density, high cost, etc. problems, to avoid voltage spikes, reduce voltage stabilizing capacitors, and achieve high power density

Active Publication Date: 2018-06-15
NORTHEAST DIANLI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the cascaded H-bridge type and the modular multilevel converter (MMC) type topology are widely used as two-stage power conversion systems. The problem is that the independent DC side of each module requires a large number of voltage stabilizing capacitors to buffer the single-phase system. Secondary power fluctuations make the device bulky, low power density, and high cost; at the same time, there is voltage imbalance between modules, requiring complex voltage balance control, which reduces system reliability

Method used

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  • High-frequency link technology-based isolation type modular multi-level converter
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  • High-frequency link technology-based isolation type modular multi-level converter

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Embodiment Construction

[0050] In order to make the objects and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0051] Such as figure 1 As shown, the embodiment of the present invention provides an isolated modular multilevel converter based on high-frequency link technology, the converter 1 includes three identical phase units 2, and each phase unit is as figure 2 As shown, it is divided into upper and lower bridge arms, and each bridge arm consists of n sub-modules and a bridge arm reactor L m constitute.

[0052] Each single-stage high-frequency isolation sub-module 3 of the present invention includes a front-stage part 4, a high-frequency transformer part 5 and a rear-stage part 6, and the topology of the sub-module is as follows image 3 As shown...

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Abstract

The invention discloses a high-frequency link technology-based isolation type modular multi-level converter. The converter adopts a three-phase system structure and consists of single-stage high-frequency isolation type sub modules; the converter comprises three phase units connected between high-voltage direct current ports PH and NH in parallel; each phase unit consists of upper and lower bridgearms; the electric connecting point N1, N2 and N3 outgoing lines of the upper and lower bridge arms of the three phase units are connected with a filtering inductor in series to form high-voltage alternating current ports a, b and c; each bridge arm consists of n novel single-stage type high-frequency isolation type sub modules and a bridge arm electric reactor Lm; each single-stage type high-frequency isolation type sub module comprises a front-stage part, a high-frequency transformer part and a back-stage part; and the alternating current side of the front-stage part is connected with the primary side of the high-frequency transformer. By virtue of a combination of the high-frequency link technology and the modular multi-level technology, capacitor supporting and voltage-sharing controlon the high-voltage side of each module are not needed; and meanwhile, the problems of secondary side current conversion, voltage spike and the like of the conventional single-stage type converter are overcome.

Description

technical field [0001] The invention relates to the technical field of isolated modular multilevel power conversion, in particular to an isolated modular multilevel converter based on high frequency link technology. Background technique [0002] Isolated medium and high voltage AC-DC hybrid conversion technology will play an important role in the fields of new energy AC-DC hybrid smart grid, high-power motor drive and ship electric drive in the future. At present, the cascaded H-bridge type and the modular multilevel converter (MMC) type topology are widely used as two-stage power conversion systems. The problem is that the independent DC side of each module requires a large number of voltage stabilizing capacitors to buffer the single-phase system. The secondary power fluctuations make the device bulky, low power density, and high cost; at the same time, there is voltage imbalance between modules, requiring complex voltage balance control, which reduces system reliability. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/483H02M3/335
CPCH02M3/33592H02M7/483H02M1/007
Inventor 刘闯蔡国伟
Owner NORTHEAST DIANLI UNIVERSITY
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