Tri-axial exciting apparatus capable of off-chip excitation of MEMS microstructure

Abstract

The invention discloses a tri-axial exciting apparatus capable of off-chip excitation of an MEMS microstructure. The apparatus comprises a sleeve, a base plate, piezoelectric ceramics, a pressure sensor, an upper connection block, a lower connection block, a steel ball, elastic support members and the MEMS microstructure, the upper end of the sleeve is provided with an annular top board, the microstructure is arranged above the annular top board through the elastic support members, guide shafts are uniformly distributed between the top board and the base plate, the lower connection block is uniformly distributed with guide support arms penetrated by a sleeve wall and sleeving the guide shafts, the upper connection block and the lower connection block are respectively provided with a spherical groove and a tapered groove for clamping the steel ball, extension springs are uniformly distributed between the upper connection block and the lower connection block in a circumferential manner,the piezoelectric ceramics are clamped between the pressure sensor and the elastic support members, and the guide support arms are respectively provided with locking devices. According to the apparatus, different pre-tightening forces can be applied to the piezoelectric ceramics, obtained measuring values of the pre-tightening forces are more accurate, the adjusting process for compensating parallelism errors of two operating surfaces of the piezoelectric ceramics becomes more smooth, and the test of dynamic characteristic parameters is facilitated.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, and in particular relates to a three-axis vibration excitation device capable of exciting MEMS microstructures off-chip. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it is fi...

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Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

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